Electronics Forum: differs (Page 337 of 579)

Underscreen cleaning cycles

Electronics Forum | Thu May 17 09:01:01 EDT 2012 | scottp

I'm not sure why anyone would pay extra for FG (fine grain) stencils. I've run studies comparing traditional YAG laser, fiber laser, and E-form stencils with regular stainless, FG, and nickel foils. YAG is the worse and should only be used for pret

63/37 Solder Paste mix

Electronics Forum | Fri May 11 09:56:58 EDT 2012 | cyber_wolf

Paste control is a subject that has a lot of unfounded claims surrounding it. What is the difference in having a "working paste jar" and a "new paste jar" Either way new and old are getting mixed at some point. We just don't buy onto the whole thing

SMT voiding

Electronics Forum | Tue Sep 25 15:54:55 EDT 2012 | davef

The more that I chew the idea of outgassing through the pad theory, the less I like it. Why would something, water???, choose to outgass through the pad when moving through the solder mask would be a path of much less resistance? And why wouldn't the

AOI False Calls

Electronics Forum | Thu Feb 28 10:22:46 EST 2013 | rway

If your silkscreen is too close to the toes of your leads, you can bring the lead bank inspection box in a little bit to compensate. I haven't had many issues with tantalum caps. I inspect those under white light with no filter just fine, but then

Quad IVc AutoProgram

Electronics Forum | Wed Apr 03 16:07:13 EDT 2013 | microaide

OK, so I think I have figured out the machine configuration for tape feeders. BTW, your procedure for retrieving the X/Y/Z coordinates for the pickup locations was wrong. So I looked it up in the Quad manual. The manual was wrong too. Correct procedu

smd capacitors- ICT measuring

Electronics Forum | Fri Jun 14 12:00:10 EDT 2013 | rgduval

Is this a new assembly/new test fixture/program? Or is this an existing assembly that is suddenly exhibiting this failure? Capacitors measured in circuit will not necessarily measure their correct values. Active components in circuit will be affec

Temperature variation Heller 1707 EXL

Electronics Forum | Tue Aug 13 10:09:10 EDT 2013 | dyoungquist

We have a Heller 1707EXL that we use for lead and lead-free production. It has both a mesh belt and edge rails. We run 90% of our assemblies on the mesh belt (leaving the edge rails wide open). I have noticed when profiling a board on the mesh bel

Combining two similar footprints - absolute no, or might work - tips to improve odds?

Electronics Forum | Mon Apr 14 17:38:18 EDT 2014 | bradlevy

I've got a small smt board I've already got working prototypes of, which uses a tactile switch. I've got another much less expensive tact switch of similar size that I had avoided due to a difference in actuators I originally had no way around. Now I

Solder Balls at component side around Pin in Paste components

Electronics Forum | Tue Nov 25 05:20:20 EST 2014 | grimus

Could be. I am making overprint to achieve proper amount of solder paste inside hole. Now I am trying to reduce maximum overprint and compensate it with step - up stencil. This could reduce effect that some particles of solder paste are not gathering

uBGA (.5mm pitch) printing woes

Electronics Forum | Wed Sep 06 18:19:37 EDT 2017 | slthomas

Hi All, We are being intermittently challenged by a .5mm pitch uBGA paste release issue. We don't build with many of these so don't have a lot of history here. We've gone through 3 different stencil designs and the most consistent performer was 4 m


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