Electronics Forum | Sun Jul 26 05:56:28 EDT 2015 | spoiltforchoice
http://www.surfacemountprocess.com/solder-paste-printing-process.html this site has some pretty good general advice for the novice. I am in no way affiliated with it and I have no idea as to its eventual commerical aims (if any). ENIG if your produc
Electronics Forum | Thu Mar 02 23:09:20 EST 2006 | praveen39
We need to clean the RMA flux residue on the PCBAs. The PCBA material is ALuminum base(Gold finish)stacked with Rogers Material PCB.Any solvent recommnedtaions? Is HCFC 141b a good solvent (quality & Price). we need to use vapor degreaser and also do
Electronics Forum | Thu Sep 12 11:26:11 EDT 2002 | scottefiske
CK, If joints have been validated prior to ICT (under BGA Scope), more often than not repeatable joint fractures are due to undo stress being placed on the component during ICT test. Verify ICT probes and fixture. If after proving out fixture/pin com
Electronics Forum | Mon Jun 12 06:45:10 EDT 2000 | kim ji tae
Hi! Thanks all who upgrade these pages. I have some questions. Is there any answer? I do double-sided reflow solderig, with 0.4% AG solder cream. with AU finished pcb. First I do reflow solder bottom side where 0.5pitch TQFP locates. Second I do re
Electronics Forum | Thu Mar 06 11:36:37 EST 2003 | O' Connor
Hi, I'm experiencing a problem on a standard part made many times before -Ni/Au finish PCB, Reflow 100% SMD parts. After reflow the gold on the pads does not fully fuse with the solder paste it remains intact on the extremities of the pads, it seems
Electronics Forum | Mon Aug 21 20:25:19 EDT 2000 | Dave F
Doug: I guess every solderability preservative has it�s fans. You know what the issue is? � A supplier that makes it�s customer happy by doing a good job processing material!!!! I�m a HASL guy myself � too much heartache with the other stuff. Giv
Electronics Forum | Mon Dec 25 08:43:35 EST 2017 | arjunkolavara
Hi , We are having Pin hole issues on the passive locations in the board after the SMT reflow process. Details: PCB surface Finish : ENIG . Solder paste : Alpha OM338 – M13 / Indium SMQ92J Location : Its Random and more on passive components. {
Electronics Forum | Fri Mar 24 03:06:35 EST 2000 | Sal
guys Using a well estrablished water soluble solder paste, but having problems with tack time. Data sheet recommend a couple of hours but we are seeing problems after about 15 minutes with 0402/0603 componenets bouncing off. The printer environment
Electronics Forum | Thu Oct 27 08:27:57 EDT 2005 | Adam
Hi We are trying to solder a a contact whose base material is stainless steel, this is then nickel striked with a gold plating of upto 3 microns. We are trying to hand solder this to a standard 1.6 FR4 PCB with a HASL finish. We are seeing problems
Electronics Forum | Tue May 28 09:27:04 EDT 2002 | pjc
Does this PBGA have eutectic balls? If so and the PCB is HASL finish, or has solder on the lands from BGA removal, you may not have to apply solderpaste. Check with you flux supplier to see if they offer a NC "flux paste" product, otherwise I know Mu
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