Electronics Forum | Tue Sep 25 15:48:34 EDT 2001 | mparker
Scavenge all the old solder off the board and the chip. Micro screen paste to the chip. As far as thickness, check your aspect ratio to determine the spec. Eliminate just one variable at a time to get to the root cause. Start by not using the tacky
Electronics Forum | Tue Feb 11 13:12:25 EST 2003 | Jim Mills
Use a PCB fab house that is capable of "Conductive Via Filling" is the way to do it right. A conductive epoxy is used to fill the drilled via PRIOR to final plating. After final plating, the surface of the "Filled Via" will appear to be the same as t
Electronics Forum | Mon Oct 26 15:38:27 EDT 2009 | davef
We believe that some suppliers replace nickel with cobalt in SN100 to product a shinier, less grainy, more attractive lead-free solder connection. SN100E sales-types like the idea that it is available in paste, bar stock, and other forms; as compare
Electronics Forum | Fri Sep 03 10:52:39 EDT 2010 | arjan
Mark, Can you send some X-ray foto's of your LGA solderjoints, I am curious about the results of a marginal paste volume in combination with the Multicore LF318. Did you follow the recommandation of LT and use also soldermask defined pads on your bo
Electronics Forum | Thu Sep 09 05:23:10 EDT 2010 | 15009
You can reduce and almost eliminate voids and other paste related defects in LGA's BGA's, QFN's etc, by using solid solder deposit. Its been around for 24 years, 13 in the US. It is now included in the new IPC 7093 specification for bottom terminat
Electronics Forum | Sat Nov 23 08:05:20 EST 2013 | emeto
Hi, I would check the thing in the following order. 1. Check paste - SPI is the best way. If you don't get the right deposit there is no wonder you have issues. 2. Check reflow profile - tweak it to the point of perfection for the board you have. 3
Electronics Forum | Tue May 07 12:50:17 EDT 2019 | sankarseptember
Thanks for the response Thomas..You are correct I got solder paste on both edge on the nozzle type 4007. But it uses for nearly 30 types of part number ..and also I will get missing without any issues in nozzle..I am unable to find the trace in that.
Electronics Forum | Fri Dec 27 14:27:40 EST 2019 | slthomas
We switched to a REL0 T3 paste, Amtech LF-4300. It wets the castellations more consistently. I believe that in our case it was more of a plating wetting issue with the parts, but yours sounds more like a pcb finish or thermal issue. That larger pad
Electronics Forum | Tue Dec 31 10:17:12 EST 2019 | emeto
Let's stay away from the PCB and process for a while. This component is pre-tinned. What kind of solder? How is the component stored? I bet you that you can put just flux on the board and solder this part - have you tried? I think we should understan
Electronics Forum | Tue Sep 25 12:50:13 EDT 2001 | mparker
Since you are mostly concerned about the flux and suspect an application issue, you need to do a few things to validate whats going on. 1. Forget about speed of processing, length of time to do the job. Focus on accuracy first, then speed. with that
