Electronics Forum | Thu Jan 05 07:38:23 EST 2006 | chunks
Assuming you mean paste and not adhesive, we use both wet and dry with vaccum. We can control the solvent thru the software for each job, so no solvent sprinkling thru the stencil. Never head of corrosion on stainless steal, but then again I'm sure
Electronics Forum | Mon Jan 09 07:50:53 EST 2006 | slthomas
When I had that luxury I always used a double pass, first wet then dry, to reduce the amount of wet solvent left on the stencil. That also gives it some time to evaporate. If you've got suction I don't know how you'd ever get any through the aperture
Electronics Forum | Thu Jan 12 11:06:27 EST 2006 | muse95
No not really. They are inspected with gloves, but all PCB's are in our facility, no matter what the finish. They are stored in the same packaging material that they are shipped in. We haven't been using ImmAg for that long yet, so maybe we will se
Electronics Forum | Thu Jan 12 17:35:34 EST 2006 | russ
We use immersion Silver for all of our lead free PCBs. They come in the "silver saver" paper you speak of and we have found that they will tarnish after 7 days in the open enviroment. Even with this tarnish we experienced no reflow problems. We are
Electronics Forum | Thu Jan 05 17:35:36 EST 2006 | russ
"And don't look for logic or consistancy in polital matters". No kidding? I am having a hard time trying to figure out how you go about determining your levels of waste and also where to find "hazardous material" classifications for my area. I am
Electronics Forum | Fri Jan 06 11:29:28 EST 2006 | mdemos1
Hi. I was curious what some common accept/reject criteria would be on copper wall thickness. For instance, if 1 ounce copper is used, I believe the IPC specification is 0.001" minimum thickness. Should the order be rejected if there is one measure
Electronics Forum | Mon Jan 09 15:49:50 EST 2006 | GS
You can find some good idea by reading IPC-J-STD-002B (or later review ) Solderability test and also the JEDEC Standard (free down load) JESD22-B102D solderability test. A suggestion, first of all check how old are the chips (read data Code on Label
Electronics Forum | Mon Jan 09 05:14:56 EST 2006 | abhinavajmera
Hi all, I want to know the possible causes of poor paste release in stencil printing process if the same brand and part number of solder paste that has been used successfully is being used with a set of process parameters which worked before. Other t
Electronics Forum | Wed Jan 11 10:08:58 EST 2006 | samir
I agree with URL. We made a mistake years ago paying a consultant for something that can be done your in-house technical staff. The consultant took a bunch of notes and suggested we all wear "finger cots". His solution didn't help us with our prob
Electronics Forum | Fri Jan 13 14:32:09 EST 2006 | chunks
You're right Dave, a GOOD company would include that in the deal. But our purchsing people get pats on backs for saving a buck or two here and there...so. It really hurts when they save 30 bucks on bulk parts versus tape and reel. Then we spend hu