Electronics Forum | Mon Apr 04 18:23:35 EDT 2005 | GS
Solder volumes is very important parameter to keep under control in order to get a good and reliable CCGA solder joint, and an automatic 3D paste volume inspection is strongly recommended practice to use. Questions: - what Column pitch do your CCGA h
Electronics Forum | Wed Apr 06 11:47:17 EDT 2005 | jdengler
Dave, Most dust and other crud is actually generated inside a plant. While working at another company they brought in consultants for this same issue. I don't remember the exact amount but only around 20% comes from the outside. Unless you are
Electronics Forum | Wed Apr 13 21:04:39 EDT 2005 | pdeuel
We have a controlled pressure facility. When the pressure is set at 0.2 lbs above outside our security doors that open outward do not close by themselvs causing alarms. Our facility remains dusty under and on equipment because of conditions listed on
Electronics Forum | Thu Apr 07 06:10:08 EDT 2005 | siverts
There are some equipment out there for this purpose, that roll some type of "sticky paper" over the pcb. BUT with this type of equipmnent, there is a high risk of loading up the pcb:s with static electricity. Therefore You must consider to use some o
Electronics Forum | Tue Apr 12 22:23:05 EDT 2005 | Al
The way we do this, is to tape a transparent film to the PCB. The printers and chip shooters can read fiducials no problems. Once it has been run through SMT, simply remove the tranparency film and the PCB is ready for use, no mess no cleaning and yo
Electronics Forum | Tue Apr 26 11:22:48 EDT 2005 | denismeloche
I have found that Sn62 solder gives better strength and leach resistance when soldering to gold surfaces. The gold needs to be at least 5 to 10 micro inches thick to prevent nickel oxidation but if over 25 micro inches will cause brittleness. I hav
Electronics Forum | Wed Apr 27 04:16:54 EDT 2005 | Bryan
Hello everyone, During our PIH process we found much flux residual around or on the joints of PIH after reflow.We use the Indium smq92j no clean solder paste.but the residual is too much to be accepted.can anybody share with me some ideas to solve th
Electronics Forum | Thu May 19 17:03:11 EDT 2005 | splice1
Hi all, There are no ground layers which makes the non wetting rate a bit confounding. The foam fluxer has not been cleaned in a while though, while there is a strong evidence of fluxing by running blank paper and looking up the top side
Electronics Forum | Fri May 27 13:01:05 EDT 2005 | c111
Well if I thought using wood tools was a good idea I would not have posted the question. Since the flash point of paper is 451F I would assum wood would be close? I guess I should have asked does anyone know of any tools kits or come up with there ow
Electronics Forum | Mon Jun 13 01:31:36 EDT 2005 | buchi79
Devef, The stand off height is 75micron. We only clean the product after underfill process. Dispense epoxy under the FC & cure it before aqueous wash. Samples are sent for LPC (liquid particle count) Test to ensure cleaniness. By the way, our plant
