Electronics Forum | Thu Apr 13 11:38:53 EDT 2000 | Kevin Facinelli
Couple more questions: The problem we have is that on the bottom side we are using a bunch of resistor networks. These have been very difficult to solder through the wave. The products: Top Side: 4-6 BGA 2/3 QFP 500 component
Electronics Forum | Mon Jan 22 15:01:32 EST 2001 | aiscorp
CIM systems for electronics assembly have traditionally considered the PCB only. Final assembly "modules" are often attached to traditional systems to accommodate this common requirement for pre-PCB assembly, mechanical assembly, and final assembly
Electronics Forum | Wed Apr 11 00:17:03 EDT 2001 | Dreamsniper
Hi, We got a 0.5mm pitch QFP144 from Altera with the below lead width specs. min. lead width = 0.17mm nominal = 0.22mm maximum = 0.27 What's the best pad or land width for the above? This is what our designer used. Land Width = Component Lead Wi
Electronics Forum | Mon May 21 17:34:22 EDT 2001 | davef
Continuing the line of Michael's, the previous poster, comments ... The more Krispy Kremes, the better. Yeth!!! The more beer, the better. Yeth!!! The more epoxy, the better. Uh, I don think so!!! We look at this from a papa bear, mama bear, bab
Electronics Forum | Sun Jun 10 12:15:37 EDT 2001 | procon
Hello Danial, Leave it up to most to blame the relow oven for their tombstoning problems when in fact it is usually the last to cause it. The biggest culprit of tombstoning is the pad design followed by the print quality. Usually, we find that the p
Electronics Forum | Thu Jul 26 21:16:18 EDT 2001 | djarvis
Dave, We don't do any inspection. Before everyone says "bull...t". Let me explain. We are an OEM. I spent six years in subcontractor hell and wouldn't go back for all the tea in China. It took me two years to convince them when I first got here but I
Electronics Forum | Thu Jan 06 17:56:14 EST 2000 | Brian W.
I agree with Dave that passte volume is the most preferable criteria. However, you need to determine what you will accept and what your process is capable of. You need to define the process parameters, put procedures in place to control them, reduc
Electronics Forum | Fri Dec 17 03:38:53 EST 1999 | cklau
Hello Guys; I "ll like to add some comment on Mr John message , see below.. "Be sure that the components to be used on the bottom can take the maximum heat of the wave and the delta T of entering the wave."-John The required preheat temp , that i
Electronics Forum | Tue Dec 14 01:05:09 EST 1999 | cklau
Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? Ans: Fur inner layers Min = .006" hole-pad annular ring ; inner pad dia - hole dia/2 For outer layers Min = .005" hole-pad annular ring ; outer p
Electronics Forum | Tue Nov 30 21:23:55 EST 1999 | cklau
hello; When we are doing component land pattern design , one thing will always be in our mind; that is the basic criteria or common land pattern design guideline for reflow and flow solder assemblies. For basic fomula in calculating resistors are:
