Electronics Forum: designed (Page 347 of 537)

Re: First Article

Electronics Forum | Wed Oct 06 15:29:24 EDT 1999 | Tony

| Our first article inspection after machine placement can take several hours depending on the complexity of the board. The operator visually checks the board against the drawing and bill of material. I'd be interested to hear if there are any other

Re: pallet design for thin pcb's

Electronics Forum | Thu Sep 23 17:31:12 EDT 1999 | DaveH

For another excellent vendor try EMC GlobalTechnologies in Pennsylvania (215)340-0650. Contact Marty Wetzel. | | | | | | any thoughs? | | | | | | thanks | | | | | | | | You should use pallets that stand the reflow as well so that no separation wi

Re: 0201 components

Electronics Forum | Wed Sep 15 19:01:39 EDT 1999 | DGrenier

| | I'm hoping to use 0201 caps and resistors in a new design but so far have only found one company who makes such small devices (Murato). | | | | Can anyone direct me to any other supplier? | | | | Are there any particular problems associated wi

Re: Step-down stencil Versus Reduced Aperture Design

Electronics Forum | Thu Sep 02 07:22:03 EDT 1999 | Earl Moon

| I'd like to know the advantages and disadvantages between the two. | | Thanks and regards, | | Both have their place. When using less fine pitch (.025" +) with fine pitch (.020" or less and BGA's) a .007" thick stencil may be used. This would re

Re: Tombstoning of chip capacitors

Electronics Forum | Wed Aug 25 15:47:25 EDT 1999 | JohnW

| | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | Most common reason is uneven hea

Re: Tombstoning of chip capacitors

Electronics Forum | Wed Aug 25 16:42:32 EDT 1999 | Dave

| | | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | | | Most common reason is

Re: Tombstoning of chip capacitors

Electronics Forum | Wed Aug 25 21:44:03 EDT 1999 | Jason Tomlinson

| | | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | | | Most common reason is

Re: Srceen Printing control parameters

Electronics Forum | Thu Aug 12 22:31:10 EDT 1999 | Dave F

| Hello, | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | B.Regards, | Felix | Felix: There are some 30 variables that affect SMT solder qua

Re: BGA fab: what's reasonable practise for double sided PCB?

Electronics Forum | Thu Jul 15 17:53:34 EDT 1999 | Boca

| I'm designing a board where the parts will only fit if I do one of the following: | | 1. Put BGAs on both sides | | 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa

Re: Through holes in SMT pads

Electronics Forum | Tue Jul 06 16:44:14 EDT 1999 | John Thorup

| Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area. Th


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