Electronics Forum | Fri May 12 13:12:47 EDT 2000 | Bill Schreiber
There are several published papers on the Smart Sonic Web Site regarding the advantages and disadvantages of using a stencil cleaner. I recommend the papers by Richard Clouthier "Improving Screen Print Yields" and "Selecting SMT Stencil Cleaning Me
Electronics Forum | Mon May 15 20:10:27 EDT 2000 | Dave F
David: How about starting with MCMs? IPC docs are: * 2225 - Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies * DD-135 - Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip
Electronics Forum | Wed May 10 22:58:52 EDT 2000 | Dave F
Michael: We all make choices. A first pass at yours is: Resin Tg�C Cost FR4 125 1 Tera Functional 135 1.1 Multi Functional 180 1.2 BT Epoxy Blend 210 1.5 Cyanate Ester 250 2 Polyimide 280 3 It's unclear about your meaning of "compat
Electronics Forum | Wed May 10 15:36:36 EDT 2000 | C.K.
I agree with you PR!! At our factory, we had trouble with 0603's!!!! Especially if you try to glue and wave them...manufacturing management, in turn, blamed the declining yields on the processes, and NOT on the product! ...and with process windows
Electronics Forum | Fri May 12 16:17:30 EDT 2000 | Greenman
Yeah, 0201's are real buggers to deal with, as the components are about the same dimensions as the PWB tolerances. Probably a good start is the paper I did with Plexus Corp., available on www.plexus.com, under the "In the News" heading. Headlines: -
Electronics Forum | Wed May 31 17:37:29 EDT 2000 | Arturo
I�m also having this problem with Panasonic film capacitor. Even when I have the correct pad size according to Panasonic data sheet the tombstoning occur. I am thinking that the problem could be the plating of the film capacitor. The only way I could
Electronics Forum | Wed May 31 23:19:15 EDT 2000 | Jackie Hsieh
I think the reasons of the tombstone phenomenon could be concluded as follows: 1.The proper pad size,including the dimension of two pads,the gap of two pads. 2.The temperature distribution must be uniform (take care the shadow-effect) 3.The ramp-up s
Electronics Forum | Wed May 10 01:00:09 EDT 2000 | gary
0.65mm pitch QFP. I believe that this is the borderline for Fine Pitch. Will I have a good paste release with Chem-etch matched with a rubber squeegee? I'm planning of a 15% reduction on the Width and no reduction on the length. Any feedback whether
Electronics Forum | Wed May 17 17:21:18 EDT 2000 | Michael Parker
Paul- Start with apples to apples comparison. What world class product are you building that would benefit from a benchmark comparison? Other than that, if you are just starting then crunch the numbers, find the highest values, do continuous improvem
Electronics Forum | Thu May 11 15:07:42 EDT 2000 | Finepitch Services
I assume your oven has a "board width" setting for every board and the conveyor width is automatically adjusted as soon as you select the profile/recipe... For the double sided reflow boards, I would set the width 1 inch (or another rounded amount)
