Electronics Forum | Fri Jun 15 09:13:53 EDT 2001 | jackofallprocesses
Does anyone have knowledge or experience with Pin & Paste on boards that are .095" thick? The boards would have mixed technology, PTH, fine pitch, and BGAs. I did a search for this info and nothing touches on this particular subject, thicker boards.
Electronics Forum | Tue Oct 19 22:27:29 EDT 1999 | Stu Leech
We have just completed some studies of with ABPAC, who is a large subcontract assembler of plastic ball grid arrays. BT laminates can pick-up appreciable moisture in just two hours. They are using TVP demoisturizing, our product (I apologize for the
Electronics Forum | Wed Oct 06 20:42:50 EDT 1999 | Mike Cooper
Yes. We use high speed dispensing (PanasonicFA)as an integral part of our PCB assembly. Our business is automotive electronics and our typical product is 2-sided smd with some through hole. We assemble topside first, through hole, then bottomside. Th
Electronics Forum | Sun Sep 26 11:54:06 EDT 1999 | Earl Moon
| i had a problem here, during the wave soldering process, we apply a water soluble mask on the gold finger to protect it from contamination. But after washing, there is still some mask left on the gold finger. | Can anyone pls advise is there any pa
Electronics Forum | Fri Sep 10 09:49:49 EDT 1999 | C.K.
1 MOHM, 18 MOHM)? | | What state are you located? | | What type of volume will you use (1 drum per week, month, year)? | | Mike | (800) 218-8128 | We are located in Illinois (Southwest Suburb of Chicago). Our usage will probably be in the 1 dru
Electronics Forum | Thu Aug 05 08:04:32 EDT 1999 | Peter Barton
| Hi , | | Could DIP package ( PTH) run through IR Reflow instead of wave soldering? | | Will there be any reliability impact on this package. | | Thanks | | Jack | | Jack, The dip component package material and the packaging process is the sa
Electronics Forum | Wed Jul 28 20:31:42 EDT 1999 | Dave F
| We are currently using a 65/35 solder for our wave process but are considering switching to a 63/37 for a substantial cost savings. No one here seems to know why we everused a 65/35 formulation in the first place. | I understand 63/37 to be pretty
Electronics Forum | Thu Jul 15 08:46:50 EDT 1999 | Mike Demos
Is anyone on the list aware of the following manufacturer or equipment? The vintage of this equipment is circa 1988. I am being asked if I want any of this equipment for our facility: Heeb SMT Placement Equipment, Model HM-60 Heeb Reflow oven, Mod
Electronics Forum | Tue Jul 20 10:16:31 EDT 1999 | Alden Lewis
| Is anyone on the list aware of the following manufacturer or equipment? The vintage of this equipment is circa 1988. I am being asked if I want any of this equipment for our facility: | | Heeb SMT Placement Equipment, Model HM-60 | Heeb Reflow o
Electronics Forum | Tue Jul 13 09:16:13 EDT 1999 | Dick Casagrande
| WOULD LIKE TO DO RELOW OF 2 SIDED SMT BOARDS. USUALLY THE BOTTOM SIDE HAS RESISTORS AND CAPS ONLY. WHEN THE BOTTOM OF THE BOARD HEATS UP, THE PARTS ARE FREE TO MOVE AND ONLY SURFACE TENSION WILL KEEP THE COMPONENT FROM FALLING OFF. | CAN BOARDS BE
