Electronics Forum | Tue Apr 23 07:51:39 EDT 2002 | cfraser
I too have experienced this problem on many occasions. Try turning you wave temperature down just a bit. If you spec allows for this it will help. The condition will not totally go away but reducing the heat will help. Of coarse you other option in a
Electronics Forum | Mon Apr 22 22:14:54 EDT 2002 | Gang shen
the case is that FUJI IP3 failed to place BGA ,when it is processing the BGA vision ,often occours the alert message. Our oprating system is MCS30,the software version is v1.3. anyone encounter the same problem? it is be appciatiate that feedback any
Electronics Forum | Wed Apr 24 11:02:01 EDT 2002 | cnoonan
This may not be the answer you were looking for, but I have worked for serveral leading technology companies and we used vision (type 10)on IP3, and QP3 machine and never had a problem with placement issues.
Electronics Forum | Mon Apr 29 10:07:00 EDT 2002 | geoff_goring
I need to find out about tin/lead diffusion and how this causes solderability problems in device lead-outs. This is not to be confused with an earlier thread of Zn/Pb diffusion - unfortunately this is was a typo.
Electronics Forum | Mon May 06 07:29:41 EDT 2002 | winter
maybe you should check the mechanism .such as the drum with the twenty shaft.and A,B AXIS'S synchronization.and the clearance fo the helical gear.check the cutter and no strange sound, check the lens and no dirty or stable.check the twenty shaft.
Electronics Forum | Mon May 06 10:27:22 EDT 2002 | JCC
What version is your firmware?? This error can be caused bt something as simple as the background nozzle disks. Are you using the old style or the new vinyl ones?
Electronics Forum | Mon May 13 19:38:34 EDT 2002 | GregH
Has anyone used a PCB baking oven to bake the above? If so, what important things do i need to take note and any special tips or problems that might arise with regards to the components? thanks and regards,
Electronics Forum | Wed May 29 14:24:51 EDT 2002 | caldon
Stick with round aperatures they work fine. If you are successfully processing fine pitch QFP's then switching to BGA's should be no problem. Profiling is a little tricky, a thermal couple should be mounted at the under/ center of the component. cal
Electronics Forum | Wed May 29 22:00:19 EDT 2002 | davef
Not sure of the package style or the specific problem you're talking about, but consider searching the fine SMTnet Archives since we have talked about this previously, several times.
Electronics Forum | Tue Jun 04 18:03:25 EDT 2002 | arzu
I recognize this problem as well, building only prototypes with all attention possible, the (small) networks need extra attention for they show opens. Maybe it helps to increase the placementforce a bit to increase the contact area to the paste befor
