Electronics Forum | Wed Jul 23 08:21:55 EDT 2003 | James
Here we go again. I tried changing paste and that did nothing. Literally solder balled up and flew to the next pad. What would be a short term fix to use up all baards with white tin. Is there a fix if the board house did not manufacturer the boards
Electronics Forum | Tue Oct 07 08:38:05 EDT 2003 | davef
J-STD-001C requires removal of gold from (through-hole) component leads when the thickness of the gold layer is above 2.5 microns to prevent problems with embrittlement. The thickness of gold on an ENIG board typically is around 0.05 micron, resultin
Electronics Forum | Sun Feb 01 15:07:10 EST 2004 | rick
Pete C Thank you for answer. Yes we have to remove solder flux so we need chemistry for no-clean flux residue. What kind of damage can i expact from ultrasonics device? you said damage IC and clock types?. We have all components in solid encapsulat
Electronics Forum | Mon Mar 08 11:54:06 EST 2004 | Wayne Smith
Currently experiencing a problem where the plastic molded bodies of tantalum capacitors are cracking during my SMT processing. Caught after our conformal coating process. I don't know where in the process they cracked. Currently running an exper
Electronics Forum | Tue Mar 23 20:55:00 EST 2004 | Dreamsniper
First Time to solder BGA's using Water Soluble. We are currently using an Aquaeous Cleaner to clean our PCB's but I find it not enough to clean the flux from under our BGA's. Has anyone had this experience before that he may like to share how he mana
Electronics Forum | Tue Apr 06 11:17:01 EDT 2004 | ccl
hi, i encounter gold surface contam issue on wire bonding ring after prebake at 150 C for 3 hrs, tis cause wire bonding non stick issue. the contam seem begin at the solder mask area toward center of the bonding ring, but is not consistance.
Electronics Forum | Fri Apr 16 08:49:07 EDT 2004 | Chris Lampron
Hi Barry, Your best course of action is to perform a thermal profile and determine exactly what the times/temps are in these locations. Try to match your profile to the recommendations of your solder paste. (Time between 130-160, Time over 183 and m
Electronics Forum | Mon Jul 26 16:31:02 EDT 2004 | Sue PH
We use Kester 186 flux and the STU people would sometimes find white residue after cleaning with Isopropyl at the solder station. We have Lenium (Petroferm)in our vapor degreasers, and now they use Lenium at their stations as well as final clean, an
Electronics Forum | Fri Jul 30 16:28:27 EDT 2004 | crios
I was just told by a visitor (PCB Experts) at our company that RFID PCBs should not be built using a no clean solder flux process due to possible reliability issues. This really got my boss going and asked me to look into this. This is the first time
Electronics Forum | Tue Aug 10 05:32:42 EDT 2004 | praveen_madaan@jabil.com
Hi, Has any body experienced the problem of poor cotacts on HDMI connectors. The connectors pins are gold plated and we see some kind of white residue on the gold pins.How to check if this is a flux residue?We are using No Clean flux in wave solderin
