Electronics Forum: cfm (Page 3542 of 7890)

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Tue Jun 16 17:51:49 EDT 2020 | emeto

Your statement is interesting, but not necessarily correct. Are shorts in the same location? Is it one short or multiple? Are there any vias in the BGA pads on the PCB? Is part MSD and handled as ESD?

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Wed Jun 17 15:20:18 EDT 2020 | rsatmech

Thank you for your valuable inputs. Current two SMT line is running and I have initiated to use two different pcb suppliers in each line. Do I need to check the plating details in issue pcba or random pcb. Kindly suggest.

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Thu Jun 18 12:43:45 EDT 2020 | emeto

I would say you check FAB drawing and see if there is any strange value on the stackup. Usually board house should inform you of these.

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Fri Jun 19 03:17:45 EDT 2020 | rsatmech

We also don't inspect any things in incoming PCBs. We have CMM but will be used when we see any abnormality. Kindly advise me on this.

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Tue Jun 30 09:59:44 EDT 2020 | cph4w

Hi SRINI, Are you able to show X-ray of these 2 locations from other board w/o bridging? Void looks almost perfect circle which I never encountered before.

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Tue Jun 30 10:25:37 EDT 2020 | rsatmech

Hi CPH, Thanks for your response. Sure I will share. But give me some time since we stopped SMT as of now. I will share you on 7/07/2020

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Wed Jul 08 02:50:30 EDT 2020 | rsatmech

Hi DucHoang, Thanks for the response. I will share the images. We are using OSP boards and issue is not at particular BGA. Can you suggest me any methods to identify the pad contamination.

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Fri Jul 10 17:27:25 EDT 2020 | rsatmech

Hi, Image 1 - Solder short image Image 2 Same component X ray image Image 3 PCBA Solder short pad image (after removing the component) Image 4 Component pad image Image 5 PCBA pad image after tinning.

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Sat Jul 11 03:01:29 EDT 2020 | researchmfg

The bubble inside BGA ball locate at via in pad and apply the resin plug hole.You shall check the cooper plating quality on PCB pad. If there is thin plating or broken on the pad then air will come from the resin plugged via and be trapped inside the

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Fri Jul 31 19:02:03 EDT 2020 | rsatmech

We are currently running different make PCB and no such kind of solder short observed. Thank all for your valuable inputs. I have escalate the issue to supplier with alternative pcb validation report.


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