Electronics Forum | Mon Oct 12 08:07:45 EDT 1998 | Earl Moon
| I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell. | | Is there a techn
Electronics Forum | Thu Jun 25 09:53:04 EDT 1998 | Earl Moon
| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | Mike, | You
Electronics Forum | Thu May 21 20:11:33 EDT 1998 | Earl Moon
| | We applaude you for your fine efforts and providing us all a place to lodge our intelectual information. Some of us were talking and wondered if you might help us with a place to park some of our past technical (non commercial) articles as a way
Electronics Forum | Fri May 15 18:26:06 EDT 1998 | Earl Moon
| | Hello. | | 1 Could anyone tell me the range of temperature | | to solder MI components? The process eng is using 400~500 | | degrees Celcius!! For standard 0805/0603 chips & TH components & | | also to touch up on ICs. What
Electronics Forum | Wed Mar 06 21:24:09 EST 2002 | davef
How could you know if your printing process is capable or in control if you don't have a print measurement tool? You�re correct that you do need a measurement tool to determine if the process is capable or in control. A $1.5k microscope and some g
Electronics Forum | Wed May 01 20:48:44 EDT 2002 | ianchan
Hi, I agree that professional-role accountability (QA, Process, Manufacturing, Materials, etc...) is of paramount importance. in fact nothing yielding results, gets to be done without followup in continual improvement action unless individuals are
Electronics Forum | Fri May 03 10:51:24 EDT 2002 | fmonette
Dave is correct. I am including additional information that comes from a recent posting on another industry forum : The proper guidelines for bag sealing are actually specified in the JEDEC standard EIA/JEP124 section 5.2.1 Packing moisture-sensiti
Electronics Forum | Sun Aug 18 06:23:34 EDT 2002 | bentzen
Hi Ken. It's always fun and a good exercise to debat on a interesting subject like this. I can see at your response that I have to clarify some of the issues. Yes, the placement machine should be the line bottleneck. And in a line with more placem
Electronics Forum | Tue Aug 20 18:15:02 EDT 2002 | davef
Haaaaa!!!! Soldering to plastic!!!! An apt analogy!!! I like to compare it to soldering to dirt. Some thing. In fact, you are soldering on nickel, when soldering on many things. It�s just that the gold, er Pd, flash enables the wetting mechanism
Electronics Forum | Wed Feb 26 23:59:48 EST 2003 | Mike Konrad
Grant, No-Clean paste + IPA = White Residue! #1: Stop using IPA #2: Switch to either a solvent-based de-fluxing chemical or an aqueous-based de-fluxing chemical. If you are using an ultrasonic cleaner for your boards as stated, do not use sapon
