Electronics Forum | Sat Dec 01 21:59:35 EST 2007 | kenferrer
Hi Eng. Yumex in our company we're using 9 zones air convection oven. When the technology on Lead Free came along conversion from non-lead free to lead free viceversa was frequently done but there's no problem on contamination. Where is your company
Electronics Forum | Fri Jul 18 16:02:25 EDT 2008 | wrongway
I think Real Chunks has your answer home plat or reverse home plate or like we use a 10% reduction on most aptures vs pad I think your problem is to much paste on the pads we used to see a lot of that with 8mil stencil thicknes on our 1206 caps went
Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr
Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads
Electronics Forum | Tue Aug 26 09:33:04 EDT 2008 | wavemasterlarry
If this board is waved soldered than you may want to look at the wave causing the BGA to reflow a 2nd time when it goes over the wave. The board bows down and the the joint liquidfies and then hardens before the board fully goes back to flat which c
Electronics Forum | Mon Aug 25 17:39:45 EDT 2008 | gdzuber
Hello, Maybe you can get closer to a solution by posting a profile. Your problem points are right where your photos show them. So, do a profile at the same points. Also, contact your flux provider and request a recommended profile using their flu
Electronics Forum | Wed Aug 27 13:15:50 EDT 2008 | vladig
Well, it's difficult to play with the profile without knowing the root cause for the problem. A simple cross-section can tell you whether the component is at fault or not. If it doesn't point out to the root cause then and SEM/EDS analysis on one of
Electronics Forum | Mon Sep 29 14:47:07 EDT 2008 | ikonify
Have seen similar problem before with regards the MSD being the cause. But also seen similar defects being found at functional test as the in-circuit test was injecting to much current during test. The devices were walking wounded afterwards. The in
Electronics Forum | Fri Sep 12 08:12:28 EDT 2008 | realchunks
Oh I agree with you 100%. I have been lucky and have not had to go RoHS...... yet. I can imagine all the hidden pitfalls and problems that could occur. But I guess that's were solid engineering pays off. Some people call it "knob twisting" but mo
Electronics Forum | Thu Jan 29 00:12:39 EST 2009 | grayman
Hi Armando, I think you have to buy a bigger reflow let say 7 zones to get the correct profile. The reason you are getting that problem is due to short profile time. What is the size of your board? What is the composition of your solder paste? Ple
Electronics Forum | Wed Apr 22 14:34:13 EDT 2009 | Quijano
Just to add a comment, we were using AIM Lead Free (SAC 305/ NC254 & 257) in the past and we had Voiding problems, then we tried Indium 8.9 HF, and we have better results, so now we are evaluating change to Indium for many of our products.
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