Electronics Forum: solder shorts (Page 37 of 94)

MLF / QFN Lead Free Shorting

Electronics Forum | Fri Apr 06 10:43:57 EDT 2007 | flipit

Hi, Anyone seeing difficulty is soldering MLFs or QFN with lead free solder? I have an MLF with 3 rows of pads on each of the 4 sides of the part and then the large center ground plane in the middle. The part is 20 mil pitch. Had good luck with l

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Sat Dec 02 10:23:47 EST 2017 | tomh

Have you ever heard of "Solder Mask Defined Thermal Pads"? I wrote a short blurb on this here - https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154.html This technology saves fabrication costs by not havi

Solder briding on QFP

Electronics Forum | Fri Jan 08 21:34:44 EST 2010 | isd_jwendell

Not specific to QFP, but I had a run of poorly etched boards. I could see the short using 75X magnification with back lighting, but only some of the time. Nasty little shorts on ~25% of the boards that cost us a boat-load of cash.

Routing Under Chips

Electronics Forum | Thu Jul 03 15:03:39 EDT 2003 | Jim Nunns

My design group wants to change our route keep out around all SMT parts to 5 mil even under the parts with zero standoff. Are others in the industry routing under parts that have no standoff? My fear is that we will get shorting if the mask is scaped

A.O.I - no salesman pitch pls

Electronics Forum | Thu Jul 17 11:36:41 EDT 2003 | caldon

My AOI wish list would include features that: 1)Character recognition, 2) Correct Placement (including missing), 3) Solder joint inspection (solder present), 4) Shorts, 5)Polarity check, 6)Coplanarity, 7)gerber/or Cad compatible (no gold boards), 8)e

Solder briding on QFP

Electronics Forum | Mon Jan 11 13:40:16 EST 2010 | cbart

are you seeing this post processing or are they coming back from your customer or field? Have you tested raw boards and raw parts to see if there are issues with either? do you have x-ray equipment? if back from the field and they had past your tes

SMT chip processing short-circuit bad phenomenon

Electronics Forum | Thu Oct 27 06:05:50 EDT 2022 | angela t

SMT chip processing short-circuit bad phenomenon mostly in the fine pitch IC pins, mostly in the 0.5mm and the following pitch between the IC pins, because its spacing is small, improperly designed template or printing a slight omission is very easy

Sir's can anyone help me..need advise

Electronics Forum | Tue Oct 04 11:54:49 EDT 2011 | davef

We'd like to help you, but we don't have a clue of what you're talking about. * Which 'heatseal' machine are you using? Is that a reflow soldering machine? See, we think of a heatsealing machine as one that bond the two sides of a plastic bag togethe

CLEANING OXIDIZATION OFF OF WHITE TIN PADS

Electronics Forum | Wed Jul 23 08:21:55 EDT 2003 | James

Here we go again. I tried changing paste and that did nothing. Literally solder balled up and flew to the next pad. What would be a short term fix to use up all baards with white tin. Is there a fix if the board house did not manufacturer the boards

Re: Reflow glue and past.

Electronics Forum | Tue Feb 08 14:49:23 EST 2000 | Travis Slaughter

I have never tried this and wouldn�t really even want to consider it. Epoxy generally cures at around 160c in a fairly short amount of time, solder paste requires much more time and a peek temperature of about 210c or more in some cases. Curing you


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