Electronics Forum: checking (Page 362 of 631)

Double Sided Reflow

Electronics Forum | Sun Jan 11 11:37:10 EST 1998 | Bob Willis

I am currently producing a Charity Report for The SMART Group on DSRS which the Group will sell and all the money goes to Charity. Does any one know of any good articles they can send me on double sided reflow assembly ? I feel that there are only br

Re: Check out CircuitCAM

Electronics Forum | Tue Jan 13 16:05:31 EST 1998 | Dan Lambert

CircuitCAM is less customized than CIMBridge, however it was developed with the everyday tasks of a Manufacturing Engineer in mind, thus bringing the cost way down. Its automates virtually every step of board assembly from machine programming all the

Linux Platform Vs Win NT/98

Electronics Forum | Wed Aug 08 04:44:59 EDT 2001 | mattiasw

We are using a MY19 p/p machine from Mydata running Linux, and we are programming it from a Windows98 station, and goes through LAN to the machine when transferring our jobs. It�s a stable machine and we haven�t experienced any negative sides of runn

voids at solder joint of chips

Electronics Forum | Fri Aug 10 15:30:38 EDT 2001 | davef

More and more pople are seeing voids in solder connections other than BGA balls than ever before. Thats because they never looked [never had the means to look] before. Now, they can't stand it and, like that zit that their mother told them not to m

Electrovert Omniflo 7 reflow ovens

Electronics Forum | Thu Aug 30 13:22:47 EDT 2001 | arzu

180deg More important are the preheat and soakzones and temp ramps. How to check: I used to do it as follows: use a TEST-PCB with fixed thermocouples and connect it to the mole. Print the profile on transparant paper. do it again e.g. each week and

double side soldering

Electronics Forum | Tue Sep 11 09:13:01 EDT 2001 | davef

Like most things in electronic assembly, this is not astrophysics. People have pasted boards, placed components, turned the board up-side down, run the board through a reflow oven, and generalized about which components: * Fall off the board. * Don

Missing componentafter chip placer.

Electronics Forum | Fri Sep 07 07:39:11 EDT 2001 | caldon

Can you confirm the components are being picked up from the feeders? If the Feeder table calibration is incorrect the components could be picked up off from the begining. This would result in 1) nozzle barely picking up the part and as the head moves

How to calcualte the capa. of smt line in high mix low volume.

Electronics Forum | Tue Sep 11 20:42:16 EDT 2001 | davef

Some folk at Cookson in Rhode Island [US] developed software to answer questions like you appear to be asking. Cookson licensed it to some meatheads in New Jersey that made a total mess of the whole thing. Then, Phil Zarro in New Hampshire got it

parts popping off during reflow

Electronics Forum | Thu Sep 13 11:21:45 EDT 2001 | aldo_maldonado

We've had several instances of parts (1206R, SOT-23) popping off of their location during reflow. Parts placement is OK, paste brick is aligned and compact before oven. But we get random parts off their location just lying somewhere else on the boar

Wetting problem of PCB after reflow soldering

Electronics Forum | Mon Sep 17 02:56:40 EDT 2001 | mugen

Hi, (me been absent for some time...) Are your brds confirmed HAL over copper? (check out what Dave F mentioned abt possible root causes) or are the brds HAL over nickle? (shd be no problem here, if so?) or are the brds strictly nickle plated pads?


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