Electronics Forum | Wed Aug 24 09:42:23 EDT 2005 | james
That is what I was looking for. The profiles did not make much sense to me. We are getting alot of cold solder joints or bumpy solder joints.
Electronics Forum | Mon Aug 29 18:16:13 EDT 2005 | RoHS Ron
Has anyone heard of IET (ietechnologies.net) and the wave solder machine they are offering? It's an Asian made, leadfree ready machine that looks fairly robust and I understand that the cost is close to 1/2 of what you would pay for one of the big 3
Electronics Forum | Thu Sep 01 10:44:32 EDT 2005 | Clampron
Hi Slaine, Actually, HMP Leaded solder is not complient, it is exempt only when the specific application requires this temp. Sorry for the intrusion but I am working on something very similar currently. Thanks Chris
Electronics Forum | Fri Sep 02 06:47:17 EDT 2005 | dougs
Is there a standard that we should aim for in respect to the strenght of the solder on SMT leads? We have a customer who are testing our product by pulling leads off of pads then returning them.
Electronics Forum | Fri Sep 02 10:10:54 EDT 2005 | Mity-C
We had a customer who came in to discuss a solder adheasion problem on some sub-assemblies we were building for them. When they arrived, they put a sub assembly in a vise and hit it with a hammer. I was speechless to say the least...... C
Electronics Forum | Thu Sep 08 09:47:20 EDT 2005 | lupo
I will try with temperature 255 C degrees. The wetting force vs. solder temperature for SAC305 is more than 265 C degrees (the temperature of trials). Thanks for the advise. Regards
Electronics Forum | Tue Sep 13 04:31:39 EDT 2005 | milroyperera
Hi, I`m using Sn633-2T-E solder paste that is specially formulated for fine pitch where 12mil pitch is applicable.I have the data sheet of this paste but the squeegee speed is not defined. What is the expected speed for solder paste printing process?
Electronics Forum | Thu Sep 15 11:44:27 EDT 2005 | LeeHoMa
hi Pete, By the way, in your successful example, what kind of soldering method is being used after the Auto-Insertion?
Electronics Forum | Mon Sep 19 07:56:19 EDT 2005 | Pop
How we can improved the Solder voids on QFN Packaging. Actually we adjust the time for solking to long . But is not affected. Pls advise. ThANK YOU
Electronics Forum | Tue Sep 20 17:39:52 EDT 2005 | russ
If the balls are eutectic (63/37) You shouldn't have any problems. All of our BGA rework is performed without paste. You have plenty of solder to make the joint with the balls themselves. Be wary of cleaning however since the standoff is less.
