Electronics Forum | Thu Oct 29 12:12:48 EST 1998 | Barry Kauffman
| | | | Does anyone know of any software programs that will verify a Pick & Place program to the Bill of Materials (BOM)? Verify meaning the Part # and Ref. Des. matching of the two files. | | | | We use GCPlace to merge our BOM with X/Y file |
Electronics Forum | Mon Dec 08 07:44:03 EST 1997 | Mika Johnsson
| I would like to hear from anyone producing high mix (~200 modules) with low volumes (5-2000 per year) using an automatic line running lot sizes in the 5-50 range. We are engaged in an investigation to invest in this capability. A view into the or
Electronics Forum | Wed May 29 08:28:41 EDT 2002 | zanolli
Hello Mr. Peterson, I don't know where you're writing from, but if you're more than 25 miles from Rhode Island, I'll humbly and graciously accept the "expert" title. In general, I have to say that the backpanel removal tools are worth the money. As
Electronics Forum | Tue Aug 13 17:34:44 EDT 2002 | pjc
The Electra is Electrovert's top-of-the-line wave solder machine. Just about the best you could get. Conveyor concerns should focus on the condition of the extruded rails. A machine that new should not have a problem, buy worth a look see. Find out i
Electronics Forum | Tue Feb 11 22:28:25 EST 2003 | davef
What do you mean by "new information"? On final module testing: * If you have hypercorroded nickel and you detect it during final testing, you'll notice it. * If you have hypercorroded nickel and you don't detect it during final testing, you'll ship
Electronics Forum | Thu Jun 10 16:23:11 EDT 2004 | davem
Hi Grant, In previous positions I've had experience with the Fuji CP43, CP6, CP642, CP643, CP65, IP3 & QP242. In operating, training and process engineering capacities. Presently, I'm working with 2 SMT lines (in a process engineering capacity) wit
Electronics Forum | Fri Mar 31 11:36:26 EST 2006 | fastek
Smart- The UP2000 is one of the most durable and easiest to operate fully automated printers ever to be designed. I would almost venture to say it was the best printer MPM ever made. Issues with them usually revolved around good or bad maintenance p
Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef
We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi
Electronics Forum | Fri Jan 05 10:15:55 EST 2007 | Cmiller
I have a customer working on a new design of a rather large board that needs to use a micro BGA that will require 8 layers. He needs to use that BGA and it does not come in any other package. He asked me about making the BGA an adapter or daughter bo
Electronics Forum | Thu Mar 18 07:17:09 EDT 2010 | phomann
Hi, I have a Fisnar I&J500 Selective soldering robot that has failed. I think it is from around 2000. The Fisnar I&J500 base has a soldering attachment on it. As I understand it, the base controller sends it a 5 bit command to the soldering unit. T
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