Electronics Forum | Tue Oct 24 15:08:42 EDT 2000 | Steve Thomas
I meant aperture width and stencil thickness, not land width and aperture width. Sheesh.
Electronics Forum | Wed Mar 01 17:18:19 EST 2000 | Eldon Sanders
That size should have been .375 X .25 X .050 thick.
Electronics Forum | Sat Nov 14 08:58:38 EST 1998 | Earl Moon
| I keep hearing about polyimide stencils, but what are they like in terms of registration and aperture accuracy? | You are hearing about polyimide as in polyimide film as Kapton (TM Dupont). This material is the stuff of flex and rigid/flex circuit
Electronics Forum | Thu Jun 18 14:46:38 EDT 1998 | Igmar Grewar
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Wed Mar 25 09:01:09 EST 1998 | Harvey Grossman
What is the recommended finish for wire bonding ? Type of AU, thickness, etc. thanx...
Electronics Forum | Fri Aug 17 01:40:55 EDT 2001 | V.RAMANAND KINI
We are in the watch & clock Business. We have a Watch IC chip that has to be wirebonded using Ultrasonic aluminium wedge bonder. The wire dia is 1.25mil. The PCB is made of G10 Glass epoxy copper clad laminate. The copper thickness is 18 microns. The
Electronics Forum | Mon Sep 17 16:03:13 EDT 2001 | jschake
The results from an experiment comparing 27 different combinations of pad dimensions concluded that the pad design with 15 mil pad length, 12 mil pad width, and 9 mil pad separation produced the best assembly yields. A 5 mil thick laser cut stencil
Electronics Forum | Fri Nov 30 15:27:19 EST 2001 | Rex Gustafson
Where can I find pcb scoring guidelines for boards with different thicknesses, panel arrays, ....?
Electronics Forum | Wed May 08 09:15:26 EDT 2002 | pjc
Stencil Thickness, Squeegee Type (plastic/rubber vs. metal) and Squeegee Pressure.
Electronics Forum | Fri Sep 13 18:01:18 EDT 2002 | dbonilla
Do you know what will be the best solder process for pins at the edge of the ceramic substrate? Thanks
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