Electronics Forum | Tue Jul 13 13:30:16 EDT 1999 | Bill Bannister
We are looking to automate the paste printing portion of our SMT process. We are looking at used equipment from DEK and MPM from 1994 onward.(DEK 260 & 265 MPM AP20 & AP27) Does anyone have some feedback or concerns with any of these machines? Does t
Electronics Forum | Mon Sep 17 17:39:24 EDT 2001 | johnw
Hi Jeff Am I correct in asumming that the dek requires different stencil designs compared to the mpm ie Take a 6th stencil and print on a dek then a mpm and the results are very diffrent The reason I am asking this is we
Electronics Forum | Mon Mar 18 20:49:46 EST 2002 | djarvis
We leave the next days quantity out overnight. Never had to do more than 4 kneads. On the inline we don't do any and the VMP 100s we only do one. Only seem to require kneading on the old clam shell printers - don't know why! That's with Indium SMQ 92
Electronics Forum | Mon Dec 09 14:31:21 EST 2002 | swagner
You want to use a rubber squeegee with as high as a durometer as you can get away with, order two or three sets of blades starting with the softest and then progress up the the hardest, the reasoning behind this is the softer squeegees will wear out
Electronics Forum | Tue Mar 11 11:22:38 EST 2003 | slthomas
Is a water-soluble flux based paste an option for the bottom side? Then you could wash the residues from the board before wave. That's the only way we've tried that process. The difficulty we had was with some disturbed joints, apparently from s
Electronics Forum | Mon Mar 24 23:56:26 EST 2003 | Dreamsniper
Can anyone who has DEK Horizon's 2D Advance Package System explain how does this below feature works? "Automatically triggered recovery sequences" Does it mean that operator need not be there to press any button to clean and recover a print if the
Electronics Forum | Thu May 01 15:08:52 EDT 2003 | k_h
If Kapton tape doesn't work, I would recommend eating a few hundred bucks and ordering a new stencil. I think your asking for more trouble trying to plug the apertures with dried paste, glue, or anything else. It will dislodge sooner or later and pro
Electronics Forum | Thu Aug 21 15:50:12 EDT 2003 | davef
Couple of points are: * You're technically correct that ball height has the potential to vary by 8 thou, but we never see that much variation. Ball heights within a lot of components vary just about nil. * When we place BGA, we smush them into the p
Electronics Forum | Wed Nov 05 13:43:52 EST 2003 | swagner
I just did a bga job with square aperture's, the reasoning is for enhanced print release and additional paste volume. Be careful of the edge to edge clearance between the stencil openings, I don't recommend going below a 8 mil clearance, you could b
Electronics Forum | Mon Dec 13 14:57:41 EST 2004 | DasonC
I run a D.O.E. and print different water soluble pastes on the same board by mini-stencil and reflow on same profile. WS709 is one of them but Indium6.2 shown less and no void then WS709. P.S.: profile may affect the result. Do U have Via in pad?
