Electronics Forum | Mon Dec 04 12:32:45 EST 2006 | russ
Made no changes to pip process for lead free. Everything stayed the same. just have to ensure that components can withstand the high reflow temp. incomplete hole fill is from aperture not being big enough. Many people forget that paste reduces in
Electronics Forum | Wed Dec 06 22:46:39 EST 2006 | SMTrework
Hi Dave, This is manufacturer applied epoxy / adhesive to minimize package "lifing" from chassis flexing and thius board flexing. I have seen the complete array area covered with this black or red epoxy in some cases (i.e. the underfill that I've
Electronics Forum | Mon Dec 11 06:29:04 EST 2006 | bwet
See before cversus after pics on BGA pad repair here: http://solder.net/services/services_pad-repair.asp The "how to" instructions for traces (and pads) is here: http://solder.net/solderingtips/PadandTrace_Repair_Solder_Tip12.wmv The skill level
Electronics Forum | Fri Jan 05 15:10:15 EST 2007 | Bob R.
How about, "Who is the person who'll be called in to spend the weekend getting the machine back up and running after a crash? If it's your home phone number on the maintenance supervisor's speed dial then it's in your best interest to have a back up
Electronics Forum | Fri Jan 12 19:49:07 EST 2007 | stepheniii
I think she might be more on track about the air flow. I would think they not only have thermal mass but also emit thermal energy well which would add to the dificutly of removing them. I think a Dpak would have more local thermal mass than the shie
Electronics Forum | Fri Jan 19 10:43:28 EST 2007 | jimmyjames
You guys are all joking right?! There aren't any contaminates in your solder, the different colors on the surface are completely normal and even expected. The top layer of solder oxidizes and the structure of the surface resembles crystals, refract
Electronics Forum | Mon Jan 29 10:12:09 EST 2007 | geb
Hi, I am wondering how often people have their GSM (1994 edition) pick and place machines calibrated. We have had ours installed for about 18 months now. It has not been calibrated since its installation. Head 2 has been picking components off centr
Electronics Forum | Tue Feb 20 08:19:54 EST 2007 | Steve
One question about the build to print statement; is there some note saying that the vias are to be plugged with mask? If so, I'm wondering when the circle of mask was done over the vias. If it was done as a secondary operation after flood coating, t
Electronics Forum | Mon Feb 12 09:44:47 EST 2007 | SWAG
Enhanced board set-up, set conveyor width, load board, (your fiducials must be accurate!), use two fiducials to set reference point, click on placement(s), move crosshair to centerpoint, use two point teach to teach one point in the center or use cor
Electronics Forum | Sun Feb 11 23:18:44 EST 2007 | M.Haris
1. If I go to the Pb-free solder paste, is it necessary that I have to change my reflow oven OR just by changing with respect to solder paste specification, I can reach my goal? 2. What is the �Low- Temperature Phase� in any solder paste alloy? 3.W