Electronics Forum: heated (Page 38 of 301)

Open BGA joint

Electronics Forum | Fri Sep 17 23:19:07 EDT 2004 | KEN

What is the component ball co-planarity spec? I have encountered many ceramic and ASIC devices that specify 7 mil max. If your stencil is 4, 5, 6 mil you WILL eventually have an open joint. You must deposit solder greater than or equal to your cop

BGA scaling

Electronics Forum | Thu Oct 14 06:27:45 EDT 2004 | davef

a disturbed solder joint. * Extended/slow cool down ramps can result in surface texture => grainy solder joint. Second, the "BGA scaling" could be a reflection of: * Too little heat (incomplete solidification) OR * Too much heat (excess grain growt

8 Zone Vs 7 Zone Reflow Oven

Electronics Forum | Tue Oct 26 22:24:21 EDT 2004 | KEN

More zones = higher thruput. Is it better to have (8) 12 inch zones vs. (7) 15 inch zones? One thought might be more parts = more cost = more potential for failure. I have a bunch of BTU's with over 12,000 heating hours of combined opertion. I

Flex PCB Assy

Electronics Forum | Tue Mar 01 10:04:21 EST 2005 | Rob

We used durastone pallets, where you mill out the profile of the panel or board and it sits flat for printing. We secured them using 3M spray mount (for singled sided) and Kapton tape. Obviously helps to have bottom side heating in the oven as you

Non-wetting: PTH on double-side reflow

Electronics Forum | Wed Apr 06 11:58:02 EDT 2005 | patrickbruneel

Hi SMT Engr With a double-header connector do you mean Double Level Right Angled Header Connector. If so there is a big difference in heat sinking capacity between the two rows, as where the pins of the top connector absorbes twice as much heat as t

reflow oven

Electronics Forum | Sun Apr 10 14:08:29 EDT 2005 | greg

Hi there I have a question about reflow oven for Pb-free technology. I've noticed that some of the manufactures offer reflow ovens with short (26-30 lenght in cm) heat zones others offer longer more then 30 cm. So there are ovens with total heat len

Flux burn off

Electronics Forum | Wed Jul 20 16:02:05 EDT 2005 | Inds

guys, I am having a problem. During my rework (SRT) process, I am trying to reach a board temp of 150degC b4 the top heater comes down for the actual rework process. Due to which the flux (tacflux 20)is burning off and i am seeing lot of non wetting

rubber masking boots for conformal coatings

Electronics Forum | Tue Nov 15 14:31:59 EST 2005 | Samir Nagheenanajar

Back in the days when I was in charge of a Paintline Dip conformal coater, I had the same issue with a non-hermetically sealed Potentiometer. We tried to use rubber boots, but the capillary/wicking action of our silicone-based heat cured coating was

Inner Layer Separation from Barrel Wall - Too Much Heat?

Electronics Forum | Thu Nov 17 20:23:55 EST 2005 | davef

We're with your customer. We believe inner layer separation is not linked to a heating excursion. What you are seeing is separation between the hole wall and the copper plating in the barrel of the hole on an unstressed PTH. Although, it's possibl

Inner Layer Separation from Barrel Wall - Too Much Heat?

Electronics Forum | Sun Nov 20 04:40:12 EST 2005 | KEN

I agree with Davef. If no evidence of gouging or pad damage exists thn I would suspect supplier issue. An easy test would be to load the hole with part and thermocouple and find out what your irons are capable of delivering. Unless you're solderin


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