Electronics Forum: packing (Page 38 of 46)

Re: Blood letting on stencil printer

Electronics Forum | Tue Oct 13 12:58:18 EDT 1998 | Justin Medernach

| We suffered our first blood letting because of razor sharp edge clamps (DEK 265LT) and operator giving it the finger. While positioning magnetic tooling pins, one of our best slipped and really sliced off a part of his main digit. This will impact

Re: Blood letting on stencil printer

Electronics Forum | Tue Oct 13 16:26:26 EDT 1998 | Earl Moon

| | We suffered our first blood letting because of razor sharp edge clamps (DEK 265LT) and operator giving it the finger. While positioning magnetic tooling pins, one of our best slipped and really sliced off a part of his main digit. This will impac

Re: equipment to vacuum seal parts

Electronics Forum | Thu Oct 01 16:46:50 EDT 1998 | Dave F

We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq

Re: Why Dry After DI? Or does smd have to pay for the boxes outta his pay check?

Electronics Forum | Fri Jul 10 14:08:46 EDT 1998 | Wayne

| Hey there smd... | Don't worry, I don't think you'll be the company shmuck, or putz, or doofus, or bone-head, or geek, or ding-bat, or...or...(hmmm, can't think of anything else at the moment)...but you catch my drift, don't ya? I only mean that un

Re: Why Dry After DI? Or does smd have to pay for the boxes outta his pay check?

Electronics Forum | Fri Jul 10 14:08:46 EDT 1998 | Wayne

| Hey there smd... | Don't worry, I don't think you'll be the company shmuck, or putz, or doofus, or bone-head, or geek, or ding-bat, or...or...(hmmm, can't think of anything else at the moment)...but you catch my drift, don't ya? I only mean that un

Re: Help me increase my first pass yields

Electronics Forum | Fri Jun 05 13:06:14 EDT 1998 | Steve Schrader

| If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure

Re: Help me increase my first pass yields

Electronics Forum | Thu Jun 04 15:41:07 EDT 1998 | Chrys

| If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure

Re: reflow theta alignment

Electronics Forum | Fri May 29 20:15:15 EDT 1998 | Steve Gregory

Whoo-doggies Jason, you said a mouthfull!! (GRIN) Anyways, 'member what I said about me being a pack-rat? Guess what? I found some documentation that I've had for a while that does document the self-alignment forces that goes on when reflowing. I ha

Re: Drying ICs any advice

Electronics Forum | Fri May 15 14:41:25 EDT 1998 | Terry Burnette 512-933-5783

| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |

Re: Drying ICs any advice

Electronics Forum | Fri May 15 10:06:28 EDT 1998 | Mike

| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |


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