Electronics Forum | Thu Oct 01 16:46:50 EDT 1998 | Dave F
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Fri Jul 10 14:08:46 EDT 1998 | Wayne
| Hey there smd... | Don't worry, I don't think you'll be the company shmuck, or putz, or doofus, or bone-head, or geek, or ding-bat, or...or...(hmmm, can't think of anything else at the moment)...but you catch my drift, don't ya? I only mean that un
Electronics Forum | Fri Jul 10 14:08:46 EDT 1998 | Wayne
| Hey there smd... | Don't worry, I don't think you'll be the company shmuck, or putz, or doofus, or bone-head, or geek, or ding-bat, or...or...(hmmm, can't think of anything else at the moment)...but you catch my drift, don't ya? I only mean that un
Electronics Forum | Fri Jun 05 13:06:14 EDT 1998 | Steve Schrader
| If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure
Electronics Forum | Thu Jun 04 15:41:07 EDT 1998 | Chrys
| If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure
Electronics Forum | Fri May 29 20:15:15 EDT 1998 | Steve Gregory
Whoo-doggies Jason, you said a mouthfull!! (GRIN) Anyways, 'member what I said about me being a pack-rat? Guess what? I found some documentation that I've had for a while that does document the self-alignment forces that goes on when reflowing. I ha
Electronics Forum | Fri May 15 14:41:25 EDT 1998 | Terry Burnette 512-933-5783
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Fri May 15 10:06:28 EDT 1998 | Mike
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Fri May 15 10:27:16 EDT 1998 | Justin Medernach
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Mon Apr 27 11:04:12 EDT 1998 | Dave
| I realize this is a SMT forum, but I have another | problem related to electronics assembly and hope there | will be someone out there that can save my life (this | time). | We build quite a few VME assemblies to which we attach | a SAM board. Fai
.gif)
