Electronics Forum | Thu Apr 11 19:06:59 EDT 2002 | tmarc
We are using 1mm pitch BGAs with a great quantity of via(s) under the component. Very shortly we will be placing CSPs with .65mm pitch. Our via(s) are solder masked, however we generally have a percentage of them that the masking is thin enough that
Electronics Forum | Fri Nov 01 14:27:27 EST 2002 | kenBliss
Based on this thread Shouldn�t the handling systems allow the worker to do what is needed on the board during the stated hand operation so the worker has minimal direct contact with it. Now for the non sales pitch, sales pitch. Doesn�t it make the
Electronics Forum | Thu Dec 25 02:44:53 EST 2003 | Grant Petty
Hi, Thanks for the advice, and what models are you running. They have a few different models Horizon, etc, and I am trying to work out what would be best for us. I need accuracy, and reasonable speed, but also want to get the inspection options, as
Electronics Forum | Thu Dec 08 08:22:58 EST 2005 | grantp
Hi, How fine pitch are you going? What kind of stencil printer are you using? We had a manual stencil printer and needed to print 1-mm pitch BGA and needed to go to laster cut and electro polish at 4 thou to get good paste release. We also went 1:1
Electronics Forum | Fri Feb 24 13:39:35 EST 2006 | Chunks
I agree with Jerry. A 7 mil stencil should work just fine for 25 mil pitch parts and 0.050 pitch BGA's. I too go 6 mil, but whith proper screen printing, you can 7 mil. You can always do 5 ot 10% reductions if needed. Use the homeplate design on
Electronics Forum | Thu Dec 14 22:28:38 EST 2006 | Tony
Hi, where can I find info about how to make the pad design to work for VSSOP48 0.4 mm Pitch & TSSOP56 0.5 mm pitch components? I should also mention that we are working in a project that this 14 layers High-Frequency RoHS board is included. The pad c
Electronics Forum | Fri Mar 16 01:26:31 EDT 2007 | CHITRA K
Many thanks for your reply. We would like to clarify two things; 1. We have recently purchased a vision system with oblique viewing facility to rotate the camera with 40x magnification, which we find useful to inspect fine pitch components . 2. Wh
Electronics Forum | Thu May 24 08:55:25 EDT 2007 | ck_the_flip
Here's some quick things to look for: 1. Does your solder paste feel like concrete, does it roll-up into your squeegee blades, and stick to your stencil? If so, your problem is the solder paste. The mixture of powder and flux, or metal load is ou
Electronics Forum | Thu Jul 12 10:15:12 EDT 2007 | swag
I've got a proto build (3 boards) that has a Xilinx FG456 fine-pitch BGA on it. Every BGA pad on the PCB has an unmasked via attached. Between the via and the pad is a thin soldermask strip, maybe .005" wide at best. I am very confident it will br
Electronics Forum | Thu Jun 26 14:25:19 EDT 2008 | jax
Current Acceptable HMP Soldering Methods: 1. Wave / Selective Solder: Some Brands require upgrades to heating elements and Pot materials 2. Laser: Works well with PTH and medium/large passive SMT. Damage to PCB masking can occur when try
