Electronics Forum | Tue Dec 03 11:59:01 EST 2002 | slthomas
We haven't run a profile yet....probably because we're a-feared to. We can't do topside preheating here to any degree because we use an aluminum plate for aligning hundreds of top side through-hole components (pots, switches, buttons, LEDs) that te
Electronics Forum | Wed Dec 04 09:24:52 EST 2002 | jseagle
I have found that preheating the solder pallets prior to use helps cut down on the solder balling. Also, we do not cool the pallets between passes and we use a spray fluxer because a hot pallet will knock down the head on a foam fluxer. We use WS f
Electronics Forum | Fri Jan 24 17:00:56 EST 2003 | razan3
RMA needs to be dry prior to the wave to work. If coverage is good and part orientation is good, then you should be okay. Pad size can be adding to the amount of material left as well. Granted it soldered before fine with .2 long leads, I would di
Electronics Forum | Mon Mar 31 01:20:42 EST 2003 | Bryan Sheh
I agree that we should bake the pcb at higher temp and for longer time.for example...95--115c for at least 4 hours. also,keep the temp from 150--170c ,60-90 seconds while preheating. completely keep the moisture and volitales out of pcb and solder pa
Electronics Forum | Tue Jun 03 21:50:57 EDT 2003 | yukim
A question regarding the rampup slop: as we cannot make the preheat time long enough due to our reflow oven limits, a Loctite technician suggested we increase the rampup slope, between the initial point (25C) and 80C, to 4C/sec, as between these temp
Electronics Forum | Mon Jun 09 17:41:45 EDT 2003 | davef
Welcome. You have selected a fascinating area to work. "What is delta temperature? Depends on what someone is talking about. Here's some possibilities: * In process equipment definition, the difference in temperature from one side of conveyor to
Electronics Forum | Wed Jun 11 15:57:39 EDT 2003 | pjc
Frank, ECD (WaveRIDER) and Datapaq (Optimiser) have wave solder machine process control devices. They will check the following: 1. Conveyor speed 2. Preheat Temps 3. Solder Temps 4. Wave Dwell/Contact Times 5. Wave Heights 6. Waves Parallelism Go
Electronics Forum | Tue Aug 05 17:19:55 EDT 2003 | csimfgeng
Another variable is whether the ground pads have proper thermal reliefs. If the pad has solid ground plane around the perimeter, the heat being applied will quickly dissipate to the surrounding metal. A proper relief of the pad will prevent the hea
Electronics Forum | Thu Aug 21 09:01:46 EDT 2003 | caldon
Dan- We here do double sided reflow: we place one side and reflow....place the other side and reflow. On the second flow the underside of the PCB- we will reduce the bottom side preheat. fortunatly for us the largest component we only place a 40pin P
Electronics Forum | Mon Mar 29 11:49:44 EST 2004 | gregoryyork
White residue, probably nothing to do with the flux but was more than likely mineral salts from resist cure problem that are only soluble in Mineral Acids. No residue is the best IF resist is good, if resist issue's use low solids Rosin No Clean and
