Electronics Forum | Thu Jan 04 13:22:31 EST 2007 | patrickbruneel
Yes Samir I�m aware of this, but thanks for reminding me. I posted this in Oct 2006 http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=10978&#Message44694 This is not going to affect us much because China is more expor
Electronics Forum | Mon Jan 15 11:21:48 EST 2007 | davef
Contractor mantra: * Profile is good * Boards are bad On profiles, the key question is: where did you take the profile? We�d guess cracked connections are giving the intermittent test results when pressing on the components. You use acoustic micro
Electronics Forum | Sat Aug 11 09:33:09 EDT 2007 | davef
Tran First, you never spoke of J-001DS in your initial post. Second, J-STD-001DS requires no baking of assemblies, only boards [and for the anal, components]. J-STD-001DS, 4.9.3 Drying/Degassing. Prior to soldering, the assembly shall be treated to
Electronics Forum | Sun Aug 19 15:34:20 EDT 2007 | davef
What are you trying to do: * Improve hole fill? * Reduce PTH voiding? Hole fill: Search the fine SMTnet Archives for stuff like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=36063 PTH voiding: Ideally, there are no voids. We're unawar
Electronics Forum | Thu Dec 06 08:57:32 EST 2007 | davef
With this small amount of background information on the situation, comments are: * If you let adhesive cure on your stencil, you should not be using Zestron 301. A hammer and chisel is more effective. * Assuming you are not letting the adhesive cure,
Electronics Forum | Tue Jan 15 15:42:15 EST 2008 | ck_the_flip
Patrick, you're right. I've only dealt with 2 different flavors of Alpha alcohol-based flux. I've always thought that the convection causes the activator to evaporate more rapidly, but this is probably just the case with older formulations. Again,
Electronics Forum | Fri Jan 18 09:44:15 EST 2008 | operator
I have searched through the topics here and none seem to address this specifically. I was wondering if anyone had any links/info directly showing how proper ventilation for fume extraction on a manufacturing floor should be handled. From my research
Electronics Forum | Thu May 08 09:36:23 EDT 2008 | ck_the_flip
CSullivan, On the great SMTNet archives, there was much discussion about how to run in this scenario. Here is one such thread: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=10483&#Message42337 Also, I wouldn't "
Electronics Forum | Tue May 20 17:09:13 EDT 2008 | davef
Sorry, we didn't do a good job of understanding your question. For more on delamination, look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=54655 ... but we're not so sure that this is a straight delamination issue, because: * One
Electronics Forum | Wed Aug 20 20:10:30 EDT 2008 | davef
Naw, accounting is boring. Standoff could be an issue. Coupla things: * Above 30 thou, just about any cleaning process, more sophisticated than a garden hose, will produce acceptable results * Below 10 thou, can be cleaned with best efforts, but not
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