Electronics Forum: 2001 (Page 376 of 378)

Re: BGA problem: open after reflow

Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef

We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng

Re: BGA problem: open after reflow

Electronics Forum | Thu Jan 18 21:52:24 EST 2001 | arul2000

>>>>Dave, The BGA substrate surface finish is NiAu, while the PCBA pad surface is HASL. The solder ball composition is SnPb 63/37 and the solder paste used on the PCBA is also the same but with 2% Silver.>>> Dave, sorry I don't have the picture with

Share info for Six sigma - BB

Electronics Forum | Mon Mar 05 18:56:47 EST 2001 | davef

Stefan: Thanks for the clarification on the Siemens machine operation. Yes Stefan, Germany and some other countries have wonderful apprentice programs. Generally, we Americans have the patience of a staving gerbil for such things. Is the ON butto

Ready, Shoot, Aim!!!!

Electronics Forum | Thu Mar 29 16:01:44 EST 2001 | johnw

Dave, It gladen's my heart to hear that I'm not the only person with problem's like this, and also that the forum is as good as ever. So route causes and consultants or JAFO's as I call them...Just Another Friggin Obstruction!. I hate the way that

Thank you.

Electronics Forum | Tue May 01 13:25:20 EDT 2001 | kaoni

Thank you Wolfgang, My time table is the amount of time it takes to get it right. I hope to have product by next December if possible. Yes, I am starting from ground zero. I need to go 201 because of the size limitations as to what I need to fit in

AOI vs. XRay

Electronics Forum | Tue May 08 11:27:49 EDT 2001 | Eyal Duzy

I will review some of the advantages/disadvantages of AOI vs. X-Ray one by one according to the main differences that you may find between them. * AOI uses optics that can "see" only visible elements. X-Ray can "see" hidden elements. There is a ve

AOI vs. XRay

Electronics Forum | Thu May 10 10:33:46 EDT 2001 | Eyal Duzy

Genny, I would like to correct part of the things that you were told. As far as I know, X-Ray tools are not positioned as tools to find solder volume simply because it is not a strong point for them. An X-Ray image is either a projection (2D transm

Types of vision recognition

Electronics Forum | Mon May 14 03:21:20 EDT 2001 | Eyal Duzy

Phil, In the considerations you make for choosing an AOI tool, you should check what a vendor delivers today and what will it be able to deliver in the future. As the role of AOI in the SMT production line evolves from "detection" to "prevention"

PIHR Inspection Criteria

Electronics Forum | Thu May 17 07:36:40 EDT 2001 | Bob Willis

Here is a copy of a draft document on PIHR Inspection I have jotted down on a flight to Scotland yesterday, any comments suggestions etc ? I have already most of the photos for the standard but as you know there is nothing in the IPC document it just

Dream Machine

Electronics Forum | Mon Jun 25 20:47:09 EDT 2001 | davef

Much of the focus of pick & place machine supplier development efforts seems to directed towards either: * Head location detection, adjustment, and control. OR * Component location prior to pick-up. OR * Component position error correction after pick


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