Electronics Forum | Sat Dec 17 08:07:06 EST 2005 | grantp
Hi, What worries me is that a lot of people speak about what they have heard, but there is no firm facts on exactly what the situation is. I did a seminar on lead free a while ago, and was told that going lead free on the components while running l
Electronics Forum | Tue Sep 25 15:54:55 EDT 2012 | davef
The more that I chew the idea of outgassing through the pad theory, the less I like it. Why would something, water???, choose to outgass through the pad when moving through the solder mask would be a path of much less resistance? And why wouldn't the
Electronics Forum | Fri Jun 04 11:54:22 EDT 2021 | cbart
We do this quote often with our older Summit machine. there are a few ways to do this. all of these are assuming you have parts on the boards already and are working around them. 1- if you have a good tech that can add solder to the pads on the PCB a
Electronics Forum | Wed Mar 22 14:46:54 EDT 2017 | solderingpro
Laser Soldering by nature is a very dialed in process. - Requiring specially formulated flux and solder paste applications that will perform while absorbing a massive amount of energy. What I believe "Gary" is attempting to say is: Laser Soldering c
Electronics Forum | Mon Jul 21 21:59:08 EDT 2003 | davef
Theory #6 [maybe 3a?]: If you change your paste to a 'non-voiding' paste, your problem will go away. It's the flux in your paste that's killing you. The flux gets trapped in the solder and then releases ejacta that form the volcanic openings in you
Electronics Forum | Tue Jul 30 17:47:50 EDT 2002 | davef
Dewetting: Solder does not adhere to lead or land, caused by: * Poor solderability of lands. * Poor solderability of leads. * Solder paste integrity. * Lead plating integrity. Need more information, please: * What is dewetting [ie, component, pad, e
Electronics Forum | Thu Jan 17 17:54:22 EST 2008 | dman97
Stay far away from the WS619 paste. It is a nightmare to get a decent solder joint out of it. And dont get me started on voiding issues with this paste. We eventually started to use Indium 3.2 lead free "water wash" paste and this drastically reduced
Electronics Forum | Sun May 30 08:50:42 EDT 1999 | Dave F
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Fri Dec 07 10:56:24 EST 2001 | franciscoioc
HI, I exeperience this problem before and I tried diferent type of solder pastes.The one that help my process is a Kester solder R596L OA this is a water soluble paste that i am very sure is going to help you.You can get the technical data at http:/
Electronics Forum | Mon Dec 04 14:27:18 EST 2006 | pjc
Solder preforms can be used in SMT assembly for through-hole pin-in-paste process. In this process and modified aperture is used to print the paste with standard stencil printing, then a solder preform is picked and placed by a machine into the solde
