Electronics Forum: after (Page 377 of 698)

J-STD-001 Par 4.2.2 Temperature and Humidity

Electronics Forum | Wed Jul 18 10:35:41 EDT 2007 | hussman

This seems like an odd request from an auditor. I can see an auditor requiring proof that you meet the J-Std, but verify? This would require you purposely damage product on a "before and after" scenario. As long as your manufacturing guideline say

Conductive contamination and the elusive solution

Electronics Forum | Fri Jul 13 17:00:34 EDT 2007 | jmelson

Oh, sure, on fine-pitch parts you need a microscope or at least a good magnifier. But, OK, you have some kind of contamination. Solder is one thing, but where are these stainless, aluminum and copper particles coming from? Stainless makes me think

PCB Warpage in Reflow

Electronics Forum | Thu Jul 12 20:20:31 EDT 2007 | seankim10

I�m having problem with PCB with 16mil thickness due to warpage. the board convex up in the middle after 1st reflow. It seams the warpage is caused by CTE mismatch between PCB and multiple TSOP's, which are covering ~80% of the bottom side board area

Philips Topaz programming question

Electronics Forum | Mon Aug 06 13:05:19 EDT 2007 | gemengr

Try this... set them on the back and teach their pick up position as stick feeder, change pick up rotation to -90 degree. before you optimize the program, change them to 8mm feeders , them optimize the the program as feeder fix. after the program

SMT before through-hole

Electronics Forum | Tue Aug 14 10:01:32 EDT 2007 | gmoritz

I have posted earlier on a UIC Radial inserter machine. We have the machine running after repair of the CnC head. However, I now have a process problem with a board that has 256x3 LED parts (768 LEDs in three colors) where only 50% of the LEDs can b

SMT before through-hole

Electronics Forum | Tue Aug 14 16:26:21 EDT 2007 | slthomas

So it's a C-n-C clearance issue? Could you go with the other cutnclinch unit...which ever you have, get the other one (one's right angled, one's offset at 45�)? Yeah, I know, they're not cheap. Other than that, hand place some of the SMT in chip bon

Solder voids in PTH

Electronics Forum | Thu Feb 21 04:41:37 EST 2008 | mun4o

hi,Toni, we use only FR4.Some of PCB we order in China and Taiwan.With these PCBs we can't any problem.Other PCB we order here in Bulgaria.The problems with voids start last year - we have voids only in PCBs from Bulgarian factory.The process is sam

Solder Joint Strength Comparison

Electronics Forum | Wed Sep 05 08:23:24 EDT 2007 | realchunks

Hi Lloyd (did I just stutter?), While I do love Steve's response, I must add that solder is not a very strong metal. And technically, it's sole purpose is to provide an electrical connection. It's a bad choice for mechanical connections, yet every

lead free for multiple reflow process

Electronics Forum | Tue Sep 11 22:40:26 EDT 2007 | philip_yam

We are testing SAC paste for thru-hole components in the 2nd reflow process. The solder joint is alright but some problem encountered in FR1 or CAM2 PCB after multiple times of reflow due to the temperature. We are very interested in Zn or Bi-based l

Cleanliness: Cross Contamination of Flux

Electronics Forum | Thu Sep 13 11:27:28 EDT 2007 | davef

After receiving either a water soluable or low residue soldered board for rework, in a real life work environment, regardless of the quality of the documentation, we can picture it a bit confusing for troop to consistantly select the proper combinati


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