Electronics Forum: solder a (Page 377 of 1481)

Re: BGA In-circuit Failure Analysis

Electronics Forum | Tue Jun 16 15:10:27 EDT 1998 | Bob Willis

Simple x-ray inspection works well have a word with those nice people at Nicolet or Glenbrook. One of them was featured on my x-ray training video for BGA. A procedure for inspection criteria is on my web site if it is of use. | | How do I mechanical

Reflow Profile Dry Out Stage

Electronics Forum | Wed Dec 13 14:15:54 EST 2000 | Chris

I have a product where an IC is soldered using a stencil which puts down way too much paste. The result is massive bridging. Anyway, one of my coworkers claimed he could eliminate the bridging by baking the circuit board in an oven for 5 min at 90

Tin Lead BGAs in leadfree paste ( pb-free paste )

Electronics Forum | Mon Mar 06 22:30:12 EST 2006 | mainenetservices

We have a customer transitioning slowly to lead free due to necessity rather than a need to comply i.e. some of their BGAs can only be purchased Pb free only. So for this we would want to produce them a leadfree soldered PCB (not necessarly RoHS comp

Re: Any help reflow soldering Through Hole parts

Electronics Forum | Mon Mar 09 16:36:38 EST 1998 | Jim McLenaghan

| We have a double sided pcb that is surface mount on both sides. Now a Through Hole connector has been added. Appart from hand soldering does anyone have info. on reflow soldering the part. The connector is 0.1mm pitch, square legs. | 1) Do you need

Functional Test Failure due to BGA ICs

Electronics Forum | Tue Jul 25 08:34:30 EDT 2006 | GS

Does your board passes also through the wave solder step ? If, yes, it could be a matter of secondary reflow on BGA ball solder joints. Best Regards....GS

Oxidisation during Reflow

Electronics Forum | Mon Nov 25 20:38:39 EST 2002 | davef

That's basically it. In a wonderful world, the oxides flow on top of the flux during heating through reflow. Obviously when compared to reflow soldering, you create much more dross with your wave by: * Pumping a large volume of very hot solder to h

Connector solderability

Electronics Forum | Wed Nov 06 17:50:46 EST 2002 | davef

I hear you on the profiling issue. That won't get at the issue any how. Your observation of solder wetting confirms that solderability is NOT the issue. You may be seeing a "cold solder connection". The issue is the TCE of the different materia

SMT Reflow temp

Electronics Forum | Tue Feb 24 15:40:08 EST 2015 | mbartel

I'm new in this industry and need a little direction. I have a wide verity of SM parts on a board, top and bottom. The larger components have a very nice reflow, good shine. The 0402/0201's has a dull almost cold solder look. The boards function and

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Wed Oct 02 15:20:55 EDT 2002 | Eric

Is there a steadfast rule of thumb for a good solder joint on an Enig Gold board. I come across this number 217C when discussing BGA profiles. Is this a published number? I sure could use a reference. Anybody feedback is appreciated.

Re: BGA PROFILE

Electronics Forum | Tue Feb 02 14:53:56 EST 1999 | Tony

| Hi everybody. | Somebody know any consideration or special care to make a profile for BGA's. | | any advice is aprecied. | | thanks | Al Carrillo | | | | Al, I have been using the same process as Justin recomendations. I have been verry su


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