Electronics Forum: index (Page 3774 of 7894)

Re: little plastic caps: what does it all mean man!?!

Electronics Forum | Thu Nov 02 10:42:02 EST 2000 | pr

I don't know about you, but plastic just screams blue to me. As long as it's consistant I wouldn't think it'll matter. Hopefully this'll appease your customer and you can move on to tidying up all the other (less important) but still meaningful aspec

Re: Solder paste SPC analysis

Electronics Forum | Thu Oct 26 17:58:49 EDT 2000 | Dave F

Steve: You make sense, but I don�t see where someone that's getting fitted for a cross is in much of a bargaining position. Oh, and you MUST charge full market 2� rates for your thoughts. We�ll have no submarket price offerings. Although, the Fai

Densipak placement

Electronics Forum | Wed Oct 25 02:09:43 EDT 2000 | keith_hodgson

We are using a Universal GSM to place Densipaks.Unfortunateley every so often we hit a spell were the Densipak is raised because either one or both of the locating posts on the Densipak has not located correctly in the hole. These are very hard to re

Release difficult from thick stencil

Electronics Forum | Tue Oct 24 09:35:56 EDT 2000 | Wister

Our important customer demanded us to use 12mil thick stencil,it is too difficult to release solder paste from stencil.it is not helpful even I ask stencil supplier polished the openings.The flux content is 10%. I want to ask if the polyurethane sque

Re: Release difficult from thick stencil

Electronics Forum | Tue Oct 24 17:04:03 EDT 2000 | Darby

Sorry,I can't help you with your problem, but would it be possible for your customer to take a little time to explain the reasoning behind their demands? I am sure we would all like to know. What are you putting on these massive deposits? Trends in b

Re: Wavesoldering

Electronics Forum | Sun Oct 22 21:18:13 EDT 2000 | Aokilab

This may be the "wetting" problem! Assuming your process parameters are normal (work OK before), the possible reasons: 1. Presence of impurity in the solder; 2. Other impurity (oil or anti-dross) on the surface of the pot; 3. Weak solderability, due

Re: Wavesoldering

Electronics Forum | Mon Oct 23 21:18:14 EDT 2000 | Dave F

Unlike components where the solder paste has been reflow soldered, wave soldered components have an "infinite" amount of solder available to make a solder connection. If you have good solder flow, pad and component termination size are going to be b

to seal exposed copper layers

Electronics Forum | Fri Oct 20 14:13:32 EDT 2000 | DENNIS XIONG

Dear all, We have a PCB design mistake that causes exposed copper layers on the edges of breakaway locations. Although we fixed the design, but we already made a lot of boards plus many made before we found the problem. I wonder if any one have some

aspect ratio for massive components on the solder side of double-sided reflowed PCBs

Electronics Forum | Thu Oct 19 12:34:36 EDT 2000 | lwatson

I can't seem to find an article about the limiting mass of a SMT component on the solderside of a double-sided reflowed PCB. I'm pretty sure that Phil Zarrow did an article on this subject. It went something like the mass/land surface area?

HASL alternatives

Electronics Forum | Wed Oct 18 09:44:38 EDT 2000 | mike weekes

we're considering PWB finishes other than HASL - the uneven plating contributed to defects and the residues exceed our goal for PWB cleanliness. What success have any of you had with CuOSP, Immersion Silver, Gold or other finishes? Did you have to


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