Electronics Forum | Wed Feb 17 17:34:17 EST 1999 | Karl Mighton
| Hello all in SMT land: | | My name is Brian G Bancroft and I work for Lucent Technologies in New jersey. I have been asked to try and find information on a bench top workstation with micro-manipulation ability, soldering capability and bin
Electronics Forum | Wed Feb 17 17:49:26 EST 1999 | Zboss
| | Hello all in SMT land: | | | | My name is Brian G Bancroft and I work for Lucent Technologies in New jersey. I have been asked to try and find information on a bench top workstation with micro-manipulation ability, soldering capability a
Electronics Forum | Wed Feb 17 17:51:37 EST 1999 | Zboss
| | | Hello all in SMT land: | | | | | | My name is Brian G Bancroft and I work for Lucent Technologies in New jersey. I have been asked to try and find information on a bench top workstation with micro-manipulation ability, soldering capabi
Electronics Forum | Mon Feb 08 12:08:53 EST 1999 | Clifford Peaslee @ SMTnet
| What did you guys do to our forum? I do not want the 5 five I want a listing of all in the last 5 days min. More and more it seems that this site getting a little less user friendly! | Thanks for the comments. Our intention is not to make it les
Electronics Forum | Fri Jan 29 15:39:04 EST 1999 | Chris Jackson
I have a recent design (1 component side only) that calls for 2 surface mounted antenna's (brass plated) to be mounted on a PCB. The problem arises when the PCB is 18x11.25 and has 15 to 20 PCB's in the pallet (IE weight, fixturing to hold the anten
Electronics Forum | Sun Jan 31 14:03:41 EST 1999 | Dean
| I have a recent design (1 component side only) that calls for 2 surface mounted antenna's (brass plated) to be mounted on a PCB. The problem arises when the PCB is 18x11.25 and has 15 to 20 PCB's in the pallet (IE weight, fixturing to hold the ant
Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process
Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga
| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro
Electronics Forum | Wed Jun 30 18:36:21 EDT 1999 | Mark
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
