Electronics Forum: viewing (Page 3787 of 7890)

Re: BGA problem: open after reflow

Electronics Forum | Tue Jan 30 02:29:16 EST 2001 | arul2000

Dave, To do further analysis we don't have the BGAs of the batch from which we had this issue. We don't face this issue now in the current production lots. The problem got solved while trying to find the root cause. Will keep updated if it occurs ag

Re: Wave solder Carrier

Electronics Forum | Mon Nov 06 11:34:54 EST 2000 | Wolfgang Busko

Hi John, can�t find that one in the archives. Isn�t all the trouble you may get dependend on the way you design the thing? For example, tight fit with with step/ridge nearly zero and clamps for holding down the inner circle to prevent vibrations. F

Re: How to do with tombstoning for component '0402'

Electronics Forum | Tue Oct 31 23:32:31 EST 2000 | DL

Have You adjusted the placement properties of your pick n place machine/software for a 0402, I'm thinking x, y and add a little z. seems to work for me :) (as a temp/perm fix) thinking also about the numerous variables involved. Your printing process

Re: How to do with tombstoning for component '0402'

Electronics Forum | Wed Nov 01 07:54:40 EST 2000 | Wolfgang Busko

Have you tried the forum�s archive ( an abundant source for tombstoning related things ) and checked for the many things you found ? Immediate help just like snipping with your finger isn�t that easy. Best thing to help is take all the info you get f

Re: How to do with tombstoning for component '0402'

Electronics Forum | Wed Nov 01 14:42:17 EST 2000 | MRMAINT

We had some similar issues on one of our products.The oven profile is critical. We found that with a gradual soak ramp up it took care of about 80% of the tombstoning.The other thing that we found was pad design issues. Take a look at the sept. issu

Re: How to do with tombstoning for component '0402'

Electronics Forum | Thu Nov 02 22:19:32 EST 2000 | Dason C

For 0402 or less, it is prefer to start on the pad design but it doesn't help right now. Senju Metal say that they have develop one of the paste can reduce the tombstoning problem but I don't have chance to test it. Please try and post your finding

Re: How to do with tombstoning for component '0402'

Electronics Forum | Mon Nov 06 14:21:09 EST 2000 | Kevin

Masking thickness can also play a factor in tombstoning (or the Manhattan Effect). If the pad is 2 mils or more below the surface of the masking this can create a problem. Depending on the thickness of the solderpaste deposition, the solder height

differentiation for board handling equipment

Electronics Forum | Tue Oct 31 17:01:22 EST 2000 | Anders Benson

What defines the Cadillacs and BMW's of board handling equipment? This industry seems to meet conditions for being commodity, and it is difficult to differentiate one line from another. But talking to people, alot of the same names come up. My the

Re: differentiation for board handling equipment

Electronics Forum | Wed Nov 01 11:08:13 EST 2000 | CAL

the same differences that seperate Cadillac and BMW's in the auto world. Lines, look, performance, convienence, sound. A conveyor with wires, hoses, loud solenoids, are undesireable. Stien Automation/ Cyclone Automation Have a Newly released conveyor

Re: differentiation for board handling equipment

Electronics Forum | Wed Nov 01 18:01:18 EST 2000 | Darby

Of the three main ones I use I like Autoveyor, robust, well priced, excellent features. DongGi - don't like. Flimsy, finicky. Nu Tek are good but compare the prices. I guess you would buy a "Rolls Royce" if that part of the line is fully automated, w


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