Electronics Forum | Wed Jul 20 11:44:35 EDT 2011 | pbarton
We do the same as LarryD. All the profilers I have seen that have thermal jackets deemed capable of going through and helping the logger survive the VP process have a lot of mass. This mass will affect the profile considerably.
Electronics Forum | Fri Jul 29 08:22:34 EDT 2011 | mskler
What will be the specifications of solder paste printing for 6 mil thikness in SnPbAg process. Also what will be the control limits fro X bar R chart. Thanks in advance for the help
Electronics Forum | Thu Aug 11 09:18:18 EDT 2011 | blnorman
We used process 1 that dave detailed. We used screen print adhesive on one line and pin transfer on another. The adhesive dots were applied to the body of the component allowing the wave to form the solder joints.
Electronics Forum | Mon Aug 22 15:54:32 EDT 2011 | dyoungquist
Check out Zenith Ultrasonics. We bought a table top ultrasonic cleaner from them to clean our electronic assemblies. Our process has been working well for us for about 3 years now.
Electronics Forum | Mon Aug 22 15:57:38 EDT 2011 | dyoungquist
How many non-hermetically sealed parts does each board have? If it is only 1 or 2, could you attach them AFTER an aqueous cleaning process?
Electronics Forum | Thu Aug 25 06:57:41 EDT 2011 | SBecmpe
I just started with this company and the machine is being used for a different process. I am noticing small differences in the wiring that do not appear to be original. Ex. The SMEMA is missing. There are unmarked wires. Schematics would really set m
Electronics Forum | Mon Sep 12 10:58:03 EDT 2011 | 4kevinl
What kind of equipments you were using to detect lead? Has any existing regulation to setup the limit of lead content to determine the lead free process?
Electronics Forum | Thu Sep 15 07:03:38 EDT 2011 | mosborne1
This looks like a flux problem to me. I would check the specific gravity of the flux. Also check the thermal profile of th e wave solder process.
Electronics Forum | Wed Sep 14 09:19:30 EDT 2011 | swag
Target those specific parts/leads with a thermal-couple and a mole and try to get the peak reflow temps up to 225 C. It's not a cure but it will improve the apperance of the solder joints.
Electronics Forum | Tue Oct 04 14:36:12 EDT 2011 | blnorman
Not aware of anyone that builds anything like the C3 selective extraction system. I know there is a move to develope and IPC test method for this process, but it's not there yet.
