Electronics Forum: viewing (Page 3794 of 7890)

Re: Equipment/Line Capability Study

Electronics Forum | Mon Sep 25 17:14:40 EDT 2000 | LarryK

Greg, Its an open ended question your asking here. What are you trying to do? Determine if your equipment is able to do what you need? E Determine your floor spacing? Determine what, if any, inspection equipment is needed? Determine constraints/line

airflow instrumentation

Electronics Forum | Fri Sep 22 17:10:08 EDT 2000 | Steve Thomas

Does anyone know of a source for a reasonably priced and simple airflow measuring instrument? A simple mechanical anemometer with a pitot tube would suffice (I think...) in this application since I'm just trying to verify proper operation of the refl

Re: Re:What are differences in Mil-P-50884C Vs Mil-PRF-31032/3

Electronics Forum | Sat Sep 23 09:50:40 EDT 2000 | Dave F

KC, Try: Mil-P-50884C - http://astimage.daps.dla.mil/quicksearch/basic_profile.cfm?ident_number=27738 Mil-PRF-31032/3 - http://astimage.daps.dla.mil/quicksearch/basic_profile.cfm?ident_number=201451

Electrolytic caps for high temp reflow application

Electronics Forum | Fri Sep 22 12:37:18 EDT 2000 | jonyoder

I am having problems with SMT electrolytic capacitors expanding and changing values after going through our reflow. The reflow profile we use includes temperatures of 200 deg C for 60 seconds and 230 deg C for 30 seconds. We need to use this profil

Re: Quad Meridian

Electronics Forum | Sat Sep 30 16:39:57 EDT 2000 | Geo

We reseantly considered purchasing the Meridian Series machine but we changed our mind. The reason for that was that Quad does not have to many installations of the Equipment, also the fact that hardly any of their field techs. have much training on

Gold contamination in solder joints?

Electronics Forum | Thu Sep 21 17:50:43 EDT 2000 | Bill Boles

Does anyone have a quick reminder for a PCB with immersion gold surface finnish going through a reflow profile: Which of the following statements is more correct? A: In order to minimize gold in the intermetallics of the solder joint, the board temp

Re: Cooling racks

Electronics Forum | Thu Sep 21 20:41:19 EDT 2000 | Dave F

Many moons ago, at another company, we bolted an oval "carousel" to the ceiling. In our case, the carousel was use to convey wave soldering pallets from the end of a in-line washer to the from-end of the wave soldering machine. The pallets hung fro

Component Failure caused by Hot Air Knife

Electronics Forum | Wed Sep 20 15:51:19 EDT 2000 | John

We are considering retrofitting our Vectra wave soldering machine with a hot air knife. I've run our problem board on a machine with this option and it does seem to work; however, there is a concern of component failure due to thermal shock. Is thi

RF surface mount assembly

Electronics Forum | Wed Sep 20 12:43:40 EDT 2000 | rcroteau

RF pcb is all gold with no typical land patterns and multiple surface mount components sharing the same pad. IPC-610-B doesn't speak to inspection criteria. The problems I'm seeing are, insufficient solder, skewed components. Some of the pads have

Re: RF surface mount assembly

Electronics Forum | Thu Sep 21 20:29:54 EDT 2000 | Dave F

Tanx Beyond keeping one in hot water, I found that this subtile approachs virually assures that you don't get promoted to the point that you get an opportunity to ruffle the feathers of the pimadonnas. Musta breathed too much flux fumes!!! Don't


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