Electronics Forum | Tue Jun 08 05:02:09 EDT 1999 | Charlie Thornton
Can anyone please help me locate details on maximum allowable temperatures of components when passing through a reflow oven. I think I want the thermal profile for the part, or a source or standard which will allow me to check if I can safely reflo
Electronics Forum | Wed Apr 21 03:10:37 EDT 1999 | Richard Cooper
To all who will be potentially my salvation, I am currently researching Polyimide stencils for possible use and manufacture. If I may be indulged - with due reference to all past enquiries and notes on the subject - can anyone offer an up to date op
Electronics Forum | Fri Mar 19 14:25:07 EST 1999 | Mark Milward
Is anyone out there familar with the Quality system six sigma, velocity and first time pass(FTP). I'm aware of six sigma programs in SMT/PWA operations, but not the concepts surrounding velocity and FTP. I would appreciate someone pointing me in the
Electronics Forum | Tue Mar 16 10:14:04 EST 1999 | Clifford Peaslee
Hello All, We have passed the beta stage of SMTnet Registration. We thank all of you who have helped us isolate the bugs. We expect there to be the occasional problem, or bug, as with any software product, but they are most likely few and far betwee
Electronics Forum | Wed Jun 16 04:18:53 EDT 1999 | forrest xie
| | | we encounter BGA soldering issue. there is always some dry joint or unclear defects after reflow and the board can't pass electrical test, but if we resoldering it through hot air gun, every thing is ok. we use the "dog bone" surface pad ,that
Electronics Forum | Mon Mar 01 13:00:02 EST 1999 | Jon Goff
Hello, I'm doing some research for a project of mine. I figured that since you sold things related to soldering, you might know. I am wondering if there are any companies that you know of that do manual soldering while standing. Tha
Electronics Forum | Mon Jan 04 15:07:27 EST 1999 | Tracy Hille
I am looking for information regarding post wave soldering of stranded wires into a circuit board using OA core wire solder. We do a final pass thru the cleaner after the hand soldering but I'm concerned about any OA flux residue that may have wicke
Electronics Forum | Wed Dec 16 10:21:44 EST 1998 | HallJ
| Has any body tried reflowing QFP's on both sides of a board. | This has been done for a long time. The only thing I have seen that could start to cause problems is when you get up to the PQFP208 's that are weighing 10g or more. For this You can p
Electronics Forum | Fri Oct 30 08:22:57 EST 1998 | Michael Nguyen
I finally got my problem figured out on the bridging, the only thing I'm finding is that I notice some litlte solder balls on the bottom of the board. Is that normal? Is that why I'm getting bridges? Has anyone came across this problem and pass the i
Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony
I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde
