Electronics Forum | Tue Feb 20 13:24:35 EST 2007 | Wave Master Larry
LISTEN i know its been awhile but i'm back.just got back from consulting in China. i tell ya them Chinese realy have there acts together. anyway ive recently been consulting for SMTA as well. you see here i am posting from thier address.i'm pretty ti
Electronics Forum | Thu Feb 15 10:40:27 EST 2007 | phil69
Hi All, I was wondering if anyone has experience of printing solder paste on to 2x2" ceramic substrates.. At present we are using a very old de haart printer with a mesh emulsion screen.. I am looking to replace this with a more reliable mo
Electronics Forum | Fri Feb 16 16:07:16 EST 2007 | ck_the_flip
I think the homophobe, SRM, is referring to this commercial: http://www.youtube.com/watch?v=JHkoZ7ngAM0 CK, no offense, but just because we share the same alias, don't mean we'll share a snickers anytime soon....now, a beer maybe.. SRM - get a lif
Electronics Forum | Thu Feb 15 21:09:45 EST 2007 | Stephen- SMT engineer trainee
1. Can anyone tell me about the water absorption(wt%) among different PCB((i) RoHS, (ii)non-RoHS, (iii) Halogen free)), I am currently facing the problems of PCB blisters after reflow process. 2. Also, please suggest the baking period/time among dif
Electronics Forum | Tue Feb 20 18:04:53 EST 2007 | coop
I am not familiar with the YV100XG pick & place but you might want to increase the mount height of these components The double stick tape isn't as thick solder paste. it might be pushing the component too far down causing it to twist. I encountered
Electronics Forum | Thu Mar 01 14:33:50 EST 2007 | rhorowitz
Dear Hansa, I appreciate your interest in the MIRTEC AOI Inspection Systems. I am a Regional Sales Manager for MIRTEC. I would like an opportunity to speak with you regarding your AOI Application. Please call me at (203) 881-5559. Sincerely, Robe
Electronics Forum | Thu Mar 01 12:40:55 EST 2007 | james
We are using lead paste on both sides, the only reason we need to change the profile is because the BGA is lead free. I decided to run the BGA side first, then the connector side. This way I am not running both sides through on a hotter profile.
Electronics Forum | Wed Mar 14 16:23:01 EDT 2007 | J
I am not sure Ersascope and X-Ray will tell you the results you are looking for. My experience with x-ray has proven that misalignment, voids, and bridging are really the only failures that can confidently be observed. You may have solder in place,
Electronics Forum | Fri Mar 02 00:21:38 EST 2007 | AMS
Hello, I havea 0.4mm pitch TQFP with heat transfer pad on the bottom side of component. I will appreciate any suggestions with regards to: 1) stencil thickness (Rest of components on board are 0603 passives and few 40 mil pitch IC's) 2) Stencil
Electronics Forum | Fri Mar 02 16:12:45 EST 2007 | peter
We are in the early stages of converting al of our customers to No-Clean solder. I expect some customers to have no objections, others I am sure will be concerned about the "residue." I know that chemistries have improved greatly and if the process i
