Electronics Forum: alpha (Page 39 of 61)

Re: silver finishes on pcbs - what about the wave?

Electronics Forum | Fri Dec 15 08:00:57 EST 2000 | Pete B

John, We regularly wave solder electroless silver finished boards (Alpha Level)with mixed SMD and through hole parts and do not have any problems. We have changed a number on PCB's from HASL to electroless silver, mainly for the benefits at SMD whe

Re: SMT adhesive recomendation

Electronics Forum | Thu Jul 06 07:30:46 EDT 2000 | John

Ralph, Typically our co-op students put down solder paste with a syringe, place the parts on the paste with tweezers, and then reflow the paste with a hot air pencil. This works pretty well when they are hand building prototypes. You can probably

Re: Fillet Lifting

Electronics Forum | Tue Aug 01 09:42:07 EDT 2000 | Gary

The Technical Services Group at Alpha Metals has spent a fair amount of time looking at wave soldered Pb-free connections. We too have observed fillet tearing, fillet lifting, and pad lifting. I have concluded that without major changes in the mate

Re: Economics for Electronics Assembly

Electronics Forum | Tue May 30 20:48:58 EDT 2000 | Dave F

John: I�ve got questions for you � � Given that the spending pattern are significantly different for design and manufacture and these are unrelated departments in most companies, what�s the point? � What would be the purpose of such a "a sensitivity

Re: S.P.O.T.T.

Electronics Forum | Tue Jun 11 14:58:45 EDT 2002 | Chris Lampron

Hello Sean, We are currently using a Pin in Paste process to mount some through hole relays. This particular board has 72 relays per. We have cut the stencil to overprint the hole. By putting a small amount of solder in the hole to flux the lead, th

solder balls and flux

Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann

My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink

Re: solder balls and flux

Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow

Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect

Conformal Coating over No Clean Flux

Electronics Forum | Mon Jan 29 11:14:44 EST 2001 | medernach

Hi all, Here's the deal. I have a customer for whom I assemble a lot of product. All of their product mix goes through a water soluble process. Much of it gets conformal coated. They are in the high power arena but some products are simply contro

Solder Balls

Electronics Forum | Tue Feb 13 07:26:26 EST 2001 | doctord

Bill, I can give you suggestions. First and foremost. Print a board and look under a microscope. Are you printing exactly on the pads? If you print on the mask, no matter how good we got the profile, no matter what paste we would get solder balls. Mo

Reflow of 0402 capacitors

Electronics Forum | Thu Mar 08 12:40:54 EST 2001 | Ralph Merk

We are currently using 0402 resistors and capacitors in our production process. Our equipment is as follows: - DEK 265 - Siemens S25/F5 - Vitronics XPM520(5 zones) - 2% silver solder Alpha WS678 The problem is that randomly some 0402 capacitors are


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