Electronics Forum: fr4 (Page 39 of 58)

Goldfinger protection

Electronics Forum | Fri Jan 02 17:47:21 EST 2004 | gpaelmo

Yes, We have done away with masking with kapton 8 yrs ago. As long as the goldfingers are leading edge you can use one of these: 1. rubber goldfinger boot/glove - contact east use to carry them...don't know if they still do. 2. fiberglass glove - ma

Crystalized Flux under BGA

Electronics Forum | Wed Aug 04 16:09:48 EDT 2004 | Dreamsniper

Hi, Thanks for your reply. I run 2 boards, using the same paste, thermal profile and the same method of aqueous cleaning, 1st is a Topline test board with topline BGA (BGA 272 with 1.27 Pitch) and the 2nd is our product PCB with our BGA from Motoro

lead pull out issue

Electronics Forum | Wed Aug 25 21:25:28 EDT 2004 | davef

First as a nit, your �substrate� is probably NOT copper. It�s probably FR4 fiberglass/epoxy. Substrate. Base Material. A supporting insulating material upon which parts, components, and elements are attached. Second, enough of that, on to your i

Lead free Solder Paste troubles !!!!

Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin

We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying

Lead free profile

Electronics Forum | Tue Feb 01 09:54:23 EST 2005 | jbrower

Hi Frank, we're still going to go with FR4 as our prefered material. Our board thickness is .062. We use an on shore and off shore vendor. Prototron I believe offers an immersion tin and excellence in china? offers an immersion tin finish. We fou

Lead free profile

Electronics Forum | Sun Feb 27 17:06:18 EST 2005 | Darby

This is the profile we came up with on a 1500 to satisfy the parameters suggested by Indium. This was on an FR4 1mm thick 4 layer pcb that I would descrbe as medium density, QFP, SOP, AL-CAP, TANTS, D-PAK, MINI SPRING COIL, SOT and CHIPS were all use

Maximum Time Above Tg for PWB

Electronics Forum | Mon Jan 24 18:04:46 EST 2005 | Dreamsniper

=130�C as per IPC-4104/21 What will happen if I expose the PWB Assembly with components to a temperature of between 135'C to 152'C, which is above Tg, for 1 hour? Will there be delamination or possible damage to my PWB? What about with the rests of

X-ray capabilities needed for Xilinix 1152-ball BGA

Electronics Forum | Thu Feb 03 13:23:30 EST 2005 | caldon

Hi Steve- We have a Glenbrook system and are pretty pleased with it....as far a value vs. cost it works great. I did have an issue with a Soic with a ground plane in the center...yes SOIC!!! The Ground plane was a heat sync that had vias for thermal

Handskin reaction!!----Please read!

Electronics Forum | Tue Apr 05 08:41:39 EDT 2005 | aj

Guys, I posted a thread on this sublect a while back and I thought we had it sorted but we have the same issue again. One of the SMT operators has chapped skin,sores which sometimes cause cuts. This looks extremely uncomfortable. We thought it was

Poor reflow over gold plating

Electronics Forum | Tue Jun 28 16:41:07 EDT 2005 | mattkehoe

Yes, .062 fr4. Like I said before, we run a lot of gold boards, as many as 25% of what goes through the shop, and we've never adjusted anything before??? Many of these are bigger by 2 X and much more dense. Reflow is not as shiny as HASL but always u


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