Electronics Forum | Wed Apr 26 12:38:33 EDT 2006 | TMC
I would suggest you do the following: get a sample / scrap board that you will be reflowing, attach thermocouples at various locations on the board, send the board to APS or whomever. Ask them to run a profile based on your solder pastes manufactur
Electronics Forum | Mon May 01 23:23:58 EDT 2006 | grantp
Hi, I off center idea we used when we started. Get a pasta cooker, and put in vapor phase fluid, and then use that. Place the product in the bottom of the inner pot, and then heat on a small hot plate. When the vapor cloud gets high enough and the
Electronics Forum | Tue Jan 11 11:14:09 EST 2000 | Wolfgang Busko
What a challenge! I think it all depends on the equipment used. Seems rereflow of BGA isn�t that good (see the advices for wavesoldering BGA populated boards). Although you might check for the tacking force by sending a sample BGA board head over thr
Electronics Forum | Fri Dec 03 03:58:12 EST 1999 | Wolfgang Busko
Hi Charly, For batch ovens there is no discussion. For inline loading interval depends on the oven you use, the amount of heat the PCB takes out of the zone and the capability of the oven to get it back in. The approximate time for the PCB to stay i
Electronics Forum | Wed May 26 18:04:16 EDT 1999 | John Thorup
| After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) | Where is the problem? | | Thanks in advance! | Check your profile at the site of cracked component
Electronics Forum | Thu Aug 13 14:10:01 EDT 2015 | markhoch
Hi Sam, I have a feeling that what you're trying to communicate is that your DPAK's are skewing off the pad during reflow. This is caused by a thermal "mismatch" where the solder paste on one side of the DPAK becomes molten before the other, then th
Electronics Forum | Wed Oct 04 15:06:57 EDT 2006 | C.K. the Flip
Hmmm.. you are in a pickle then. I have AIM's "Reflow Profile Supplement" where they recommend a Low-Long-Soak (LSS) profile for situations like your's. It's an old-school type profiling approach where you ramp up to 120*C for about 1 min. then soa
Electronics Forum | Wed Feb 12 08:10:49 EST 2020 | majdi4
We can't do that because we are using dual ligne reflow oven..So the two sides of PCB are soldered with the same reflow profil.
Electronics Forum | Fri Sep 28 10:36:34 EDT 2001 | gdstanton
Folks, We completed our run of these boards yesterday and indeed the problem was resolved by modifying the reflow profile. Thanks to all who responded to this posting. Cheers!
Electronics Forum | Fri Oct 20 05:55:16 EDT 2006 | Eric Chen
40% in wetting problem. I would like to know any specific reflow profile in order to acheive good wetting at this type of lead. Besides, any specific paste e.g. halide containing paste required
