Electronics Forum: boarded (Page 384 of 1638)

Batch Ovens

Electronics Forum | Tue Nov 08 22:17:57 EST 2005 | grantp

Hi, I would be interested in the data, and I after our experience with batch convection I am quite skeptical. I would be very interested in temperature plots. What I would like to see before I ever considered a batch convection oven is how the oven

Do you need to bake after parts are in the Dry Cabinet

Electronics Forum | Mon Jan 30 16:30:55 EST 2006 | GS

Hi James, it could be the problem is due to residual of cleaner media entrapped under low gap of QFP 208 and 0,5 mm lead pitch. I remember in the past we had random problems of failure at test after board wash off process (DI Water wash). We met

Big Holes (no Pun intended) in the IPC610D Criteria for Shrink/t

Electronics Forum | Mon Feb 20 13:29:44 EST 2006 | patrickbruneel

Great work Amol, Please keep us posted about the results of the x sectioning. I personally don't believe that the cracks are due to non-eutectic properties of SAC. Because the alloy is only 4�C off eutectic and when a solder joint exits the solder

Local Fiducials

Electronics Forum | Thu Oct 19 16:12:59 EDT 2006 | sliebl

Our machines can't use 'cad data' for fids. I'm intimately familiar with these machines as I've been using them for 11 years. Most likely, it's a limitation of our machines/software, whereby it requires symetrical local fids. When we place a PCB on t

AOI: Agilent vs. Omron vs. MIRTec/YESTech?

Electronics Forum | Fri Dec 01 17:18:31 EST 2006 | Jim

Doing a head-to-head comparison is best. Use the same boards with the same defects to compare programming time, inspection speed, amount of inspection types you can program for and of course defect detection. Finding the defects that occur in your pr

Solder flow Ni/Au

Electronics Forum | Thu Mar 08 08:03:16 EST 2007 | ck_the_flip

ENig can vary in quality, but I've never seen an ENiG board that's been downright unsolderable. At a CM where I worked, I had to prove a QE wrong. He was flippin' out (*no offense*) about black pad, something commonly seen on ENig boards, so what I

ICT

Electronics Forum | Sat Mar 10 08:05:09 EST 2007 | davef

Here's your test definitions [clipped from the dictionary in the fine SMTnet Library]: * Test, Automated. Computer controlled electrical testing of parts, assemblies, or finished products. * Test, Built-In (BIT). An electrical testing technique whi

Selective Soldering Equipment

Electronics Forum | Fri Dec 07 12:01:14 EST 2007 | elg1

The 3000 hours is correct. It was a VERY fast ROI! Back to the discussions on the earlier threads, some of this information is correct. If you exceed the design limitations for keep out requirements and your board tolerances vary, you can have twe

What caused this reflow issue?

Electronics Forum | Thu Apr 17 10:44:24 EDT 2008 | rculpepp

I'd suspect contamination also, possibly from the board supplier. Sr. Tech's post mentioned what looks like a blister on the board, in the upper right of the Q19 photo. This could very well be a contaminate from the PWB fab shop. I've seen similar pr

Lead Free De-Wetting...

Electronics Forum | Fri Apr 25 11:38:22 EDT 2008 | vortex337

Our company has run into an issue with de-wetting of lead free components. Our profile is dead on with paste manufacturers specs. We have had this issue with both gold immersed, and hot air leveled boards. We have tried three different solder paste m


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