Electronics Forum | Wed Mar 22 01:24:54 EST 2006 | Joseph
Dear all, Referring technical report from Vitronics Soltec, "Pad lifting, fillet lifting and fillet tearing issues in LF soldering". The use of LF solder alloys today has brought about a recurrence of this crack formation, called fillet tearing. The
Electronics Forum | Sat Mar 25 07:25:36 EST 2006 | smartasp
Hi There To answer your question 1 minute at the best. We are using 2 Opal XII and have the optional feeder exchange trolleys, which enables us to setup feeders off line and just exchange the trolleys onto the machines. The changeover can be done i
Electronics Forum | Wed Mar 29 18:20:07 EST 2006 | LD
We are also a high mix/low volume OEM and are running Samsung CP45's with quick change carts on both sides of the machine. We currently average 12 minutes of internal changeover time per run with an average of 17 changeovers/day for 2 shifts. We ty
Electronics Forum | Sat Apr 15 09:07:22 EDT 2006 | samir
Amol, We pulled off this "hybrid profile" with a leaded solder paste. We recently got our tensile test report results, and our Pb-Free BGA / Pb Paste sample broke off during tensile tests at the pad/substrate interface, and not the joint. This ind
Electronics Forum | Thu Apr 20 13:55:31 EDT 2006 | cyber_wolf
Here is the problem : We have 2 AP25 printers with dedicated tooling. After we run side one boards through reflow, we get some warpage in our boards occasionally.(Sometimes we get a lot of warp depending on the geometries of the substrate) When the
Electronics Forum | Fri Apr 21 09:07:50 EDT 2006 | Timothy
My company is currently using point source soldering of SMT components. We have seen some problems due to improper soldering and are looking to switch to a reflow oven/hotplate assembly. Our PCB's range in size but are no larger than 5"x5" and we as
Electronics Forum | Mon May 01 23:23:58 EDT 2006 | grantp
Hi, I off center idea we used when we started. Get a pasta cooker, and put in vapor phase fluid, and then use that. Place the product in the bottom of the inner pot, and then heat on a small hot plate. When the vapor cloud gets high enough and the
Electronics Forum | Tue Apr 25 10:13:17 EDT 2006 | slthomas
What kind of parts are on the bottom? Small passives are very unlikely (won't unless other abnormal factors come into play) to fall off when reflowed a second time regardless of temperature differential. There is a simple weight/soldered surface ar
Electronics Forum | Tue Apr 25 22:16:31 EDT 2006 | KEN
I agree with Russ. The problem is your thermal isolation is so small 1/16 inch. Also, most ovens measure temperaure in the plenum. You don't solder in the plenum. Therefore, you have a intermidiate "zone" temp. mixing between the top and bottom
Electronics Forum | Wed May 10 09:15:12 EDT 2006 | DJuelich
We currently have 5 MyData machines in our facility. Our production lines are the Mydata Synergy package which is two My9 machines connected together and both machines have the Hydra heads in them which is giving us 15k cph and these are rated at 27
