Electronics Forum: designing (Page 387 of 537)

Board support issues

Electronics Forum | Tue Sep 18 13:58:01 EDT 2001 | ert002

50%) only over the appertures where there was poor support. Most prints took 2 knead strokes to print OK, but this caused fine pitch leaded devices to almost short. stencil had to be be wiped after kneading. 2 similar devices with exactly the same

Dek compared to MPM

Electronics Forum | Tue Sep 18 15:28:56 EDT 2001 | jschake

This is an interesting dilemma you have been faced with. If both machines are outfitted similarly and running under identical process settings then they should produce nearly the same results, in theory. I do not dispute the observations you are re

Inverted Chip Resistor

Electronics Forum | Wed Sep 26 16:32:40 EDT 2001 | davef

Placing a component the correct side up: * May affect heat dissipation. [Umm, that sounds like stretch, but who knows what designers think about?] * Allows reading the markings on those components that have markings, however cryptic the notation of

Fine Pitch QFP Bowing after reflow

Electronics Forum | Wed Oct 17 10:37:13 EDT 2001 | davef

Help us understand your situation better: ARE THE QFP BOWED? If so, * Where are the QFP bowed? * Is the QFP body bowed or is it just the leads? * How much are the QFP bowed? * Are all QFP the same part number, from the same supplier, date code

Product Changeover (SMT double sided)

Electronics Forum | Mon Oct 29 15:58:47 EST 2001 | davef

Kitting: Buy-in material in kit form that is complete and in the proper form. Line set-up: Layout all boards to be the same width. Printer set-up: Use a dispenser, instead of a printer. Dispenser set-up: Program & debug off-line. Placement machin

Thru hole DIP I.C. to convert in SMT

Electronics Forum | Thu Nov 01 17:35:04 EST 2001 | davef

A couple of things: * Don�t do it. Securing both the plastic case and the lead to prevent breaking the case seal is very difficult to do while you reform the lead. Just resell the parts and buy the correct parts. * If you will not listen and insist

bridging between 2 pads

Electronics Forum | Wed Nov 07 21:16:44 EST 2001 | davef

Consider using the following hierarchy of rules for pad design: 1. If you have a land pattern in a manufacturer�s data sheet, use it. 2. If the data sheet doesn't have a land pattern, but does have an RLP (registered land pattern) number or JEDEC n

Screen Printing Adhesive on Mixed Technology Boards

Electronics Forum | Mon Nov 26 15:30:35 EST 2001 | jhingtgen

To all, For the benefit of everyone there will be a session conducted at APEX on this topic. I have included the information that I pasted from the APEX website (http://www.goapex.org). ADHESIVE PRINTING Chris Marinelli, Loctite Tuesday, Janua

Voiding in uBGA's w/blind uvia's in pads

Electronics Forum | Tue Nov 20 20:58:43 EST 2001 | davef

Very coo!!! [You have done an outstanding job of describing your situation.] I guess the via are connected to a BIG chunk of copper that affects your profile on that pad / ball. At the same time, run a profile each on a: * Void pad * Nonvoid pad

Oh GOD!

Electronics Forum | Thu Dec 13 21:14:46 EST 2001 | davef

See. That's the connector that I thought it was. No, don't change your project!!! It sounds perfect. This will be a wonderful "learning experience" for you. You should get yourself a magnifying glass, some solder, and a soldering iron and go t


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