Electronics Forum | Tue Sep 12 07:15:33 EDT 2006 | bwet
I have a thought question for you SMT process engineers out there. We are attempting to have a part selectively drop off in a reflow oven on a 2-sided l-f SMT assembly. In order for this to happen we will have to make sure during the reflow cycle th
Electronics Forum | Tue Sep 12 10:55:29 EDT 2006 | slthomas
I found this searching the archives. Unfortunately Bob doesn't seem to have an active site anymore, just references by people he works for. It's a shame, because there was a load of good stuff there. Haven't looked at Phil's site for a while but it's
Electronics Forum | Thu Sep 14 19:19:38 EDT 2006 | SWAG
I would try to panelize as big as you can for sure as you'll spend more time handling single boards than running anything. Additionally, this size is very close to smallest capabilities on GSM depending on your configuration. Fids on all boards in
Electronics Forum | Fri Sep 15 16:30:13 EDT 2006 | russ
yes there is Caveman, (well maybe depending on your circumstances) you need to purchase a manual printer and print the connector then flip and print the other side. (you need a manual printer so you can print after the parts have nbeen reflowed, we
Electronics Forum | Fri Sep 22 12:21:06 EDT 2006 | daxman
We are using the Universal tooling..the one with the side plates. I'm not sure what the C-tool is. The machine did not come with much. I'm running the vision system test now..I've never done it before..but I'll let you know what happens with it. To
Electronics Forum | Sat Oct 21 19:25:42 EDT 2006 | Ola
I assuming that you already have checked the fuses? Also, check all the power: +5V, +12V, +-24V, etc. We had to change our PSU once, after a major power-drop due to a thunderstorm. But you should be ok if you can pinpoint what type of voltage you are
Electronics Forum | Sun Nov 05 23:01:53 EST 2006 | Sxsxcx
ok, sorry ,750 was deg F and which I said 350~400 were deg C, I got a mistake. As I know, we use 660~720 deg F to do reworking for lead free solders such as SAC series and SnCu0.7 series solder to protect irons and components on boards. when temp.
Electronics Forum | Tue Nov 07 18:18:03 EST 2006 | Andrea
I am wondering how to move from hand soldering our ceramic caps to doing a reflow type process. The reason for the change is too many cracked ceramic caps. I have asked our vendors to assemble our boards via reflow but because of our hardware (swaged
Electronics Forum | Wed Nov 08 08:48:45 EST 2006 | markhoch
Okay, here's the deal-e-o....I need to find the Nation's Best BGA Rework Specialists. I have 50 PCBs each measuring about one square inch, that need to have a BGA Ring Socket Removed, eight capacitors removed, and a new ring socket installed. Sounds
Electronics Forum | Tue Nov 21 12:35:59 EST 2006 | CK the Flip
It probably depends on the Silver content. We are also using Sn62Pb36Ag2. The paste manufacturer told us that the reason for the small silver content was so that it could wet better to the lead-free component and board finishes bearing silver.
