Electronics Forum | Mon Jun 17 19:10:04 EDT 2013 | hegemon
You have not mentioned exactly how the BGA was reflowed onto the board. Was it sent through the oven again after the mini-stencil, or was it heateed up and reflowed using a BGA rework station, or other hot air device?? From the sound of it (outside
Electronics Forum | Tue Aug 13 06:23:51 EDT 2013 | mccabekev
We are running a Heller 1707 EXL reflow oven, but we have a temperature variation across the board. When the oven first comes up to temperature, the centre of the board is 10degC hotter than the inside rail which is a further 10degC hotter than the
Electronics Forum | Thu Sep 19 10:22:14 EDT 2013 | rgduval
With the Pb-Free BGA on there, you'll want to use pb-free solder paste for assembly. The logical course of action would be to use Pb-free solder paste for the entire assembly, and to reflow at the temperatures necessary for the BGA and Pb-free paste
Electronics Forum | Sat Nov 23 12:39:18 EST 2013 | joeherz
We installed a Soltec Delta 3 a few months ago and have been trying to run with a VOC free no clean. We're using SN100C in the pot. We are spraying the material and have top/bottom preheat. Evaporation of the water in the flux is a bit of a stru
Electronics Forum | Fri May 23 00:16:31 EDT 2014 | edriansyah
Hello all. I need you advice and opinion on my problem with BGA drop off from the boards. Initial defect was ICT fail, but due to some accident, the board fell off, and the BGA just pop out. After some search, I end up to conclude it is a black pad
Electronics Forum | Wed Aug 06 14:49:06 EDT 2014 | dyoungquist
Sn62Pb36Ag2 has a higher liquidus point of 189C as compared to Sn63Pb37 at 183C. You may need to slightly adjust your oven profiles to use it compared to SnPb. We have had good solder-ability and reliability with it in our IPC Class II products. A
Electronics Forum | Fri Dec 05 13:57:37 EST 2014 | emeto
Hi, Do you observe any part warping in the corners? Do you X-ray 3D? I really doubt that all joints are fine and the part wouldn't work, but if so, your problem should be part related.If you have a temperature controlled facility I wouldn't even thi
Electronics Forum | Tue Jan 27 10:52:22 EST 2015 | dyoungquist
Taking a shot in the dark...... Are you using the correct oven profile for the connector? Solder tends to flow (wick) towards the hottest part of the connection/pin/pad it is on. It may be that the hottest part is the connector itself where the pi
Electronics Forum | Tue Apr 14 20:28:03 EDT 2015 | carlosdugay123
Hello Marshall, I represent Metal Etch Services, we manufacture SMT Single and Multi-Level Stencils, we have over 25 years experience and one of the reasons most of our customers like us is because we offer technical assistance. Regarding the issue y
Electronics Forum | Fri Mar 06 07:15:38 EST 2015 | saoasasd
Hi, I have faced some problems with DQFN PACKAGE 132 PIN. After some cross sections and dye pry analysis we could find a head on pillow situation always on inner row pads. The PCBAs are double side and the DQFNs are assembled on Bottom side (Noteboo
