Electronics Forum: sets (Page 388 of 456)

Oven Profile

Electronics Forum | Mon Mar 08 19:41:31 EST 2004 | Ken

Robert, what you have provided is not a "profile". It is a "recipe" or "job". I have 4 BTU VIP98's. I have hundreds of recipes...Your temps look similar to mine....but what does that have to do with the "thermal profile" as experienced by the asse

Can anyone recommend a reflow profile for already flowed solder?

Electronics Forum | Wed Apr 21 11:33:20 EDT 2004 | tigerlordgm

As one of our small batch processes, we place BGAs on PCB without using solder paste. We apply tacky flux to a predetermined height on a pallet, "dip" the BGA into the tacky flux to wet the solder balls to the set height, and then use a BGA rework st

Can anyone say NOT to use my reflow profile???

Electronics Forum | Wed Apr 21 18:24:13 EDT 2004 | pjohnson@volterra.com

Simple process - we use similar Kester solder brands of "no clean" low residue solder wick to clean our pads, then brush with isopropyl, and apply Kesters brand of tacky flux under a Leica 6x microscope. We do this on 7x7mm and 9x9mm packages. This w

Moisture Sensitive Devices

Electronics Forum | Thu May 06 08:29:41 EDT 2004 | Christopher Lampron

10% RH) Do these stored components need baking before I use them now or not? * Depends on the MSD level (should be marked on packaging) Level 6 component need to be baked prior to asembly no matter what. Other levels should be OK if they were store

Pb-Free wave Soldering - With or Without N2 ?

Electronics Forum | Mon May 17 16:34:25 EDT 2004 | pjc

I am an equip mfrs rep. I took a customer to my wave solder principal's factory to run their boards on a wave with no-Pb alloy, (Sn96.5 Ag3.0 Cu0.5) in air environment. The results were excellent with pot temp of 263C (505F). Their boards are low to

Volume of paste deposited with respect to board thickness

Electronics Forum | Tue Jun 01 07:26:55 EDT 2004 | johnwnz

Alistair, your paste deposit is controlled by a few things: Stencil thickness Squeegee pressure Squeegee speed Print gap in 99 out of 100 applications for paste printing you would have a print gap of 0 i.e. on contact printing where the PCB is in fu

New Pick and Place Operation

Electronics Forum | Wed Jun 02 16:33:08 EDT 2004 | davem

Fuji is the best, but there are other alternatives besides Quad. If you really want to look at Fuji, take a peek at their XP142E series. With "Vision processing on the fly" and a "Mini Turret Head" with 12 placement nozzles it should fit your needs n

US Unfair Trade Practices?

Electronics Forum | Tue Jun 08 09:58:12 EDT 2004 | Specious

Have Thoughts on Unfair Trade? If you do, then now is the time to speak up. In another Commerce Department announcement, made May 27, the newly created Unfair Trade Practices Task Force is accepting public comments. Comments should identify unfair t

Multi-part reeling for pick and place

Electronics Forum | Fri Jul 16 13:41:24 EDT 2004 | Frank

I agree with everybody here. There are plenty of better options than what you have proposed. Without knowing your equipment brand, or what type of offline software you have, if any, I have a few suggestions. 1) If you don't have any offline softwa

Vapor phase versus forced convection

Electronics Forum | Wed Aug 18 00:53:16 EDT 2004 | Grant

Hi, I think you cannot go wrong with Convection. If you want to experiment with VP, just get some of the fluid and put it into a pasta cooker on a standard domestic hot plate. Have a basin full of cold water so after reflow you can lift the cooker a


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