Electronics Forum | Wed Jun 27 11:13:44 EDT 2012 | mosborne1
We are seeing PLCC socket leads not soldered in our SMT process. We are using a KIC thermal profiling device and we are on 50% greem light process window. All other solder joints on the board looks great. The solder flowed what looks like perfect on
Electronics Forum | Thu Jul 05 15:33:12 EDT 2012 | dmiller
That's a long board! Based on your description, it sounds like board stretch may be your issue. Look at where the paste is printed on the board. If you have board stretch, you'll see the print off to the left on the left side of the board and off
Electronics Forum | Sat Jul 07 11:45:26 EDT 2012 | btipcb
I purchased and am setting up a used QSA30. It has been a little frustrating but I finally have an almost program. The isse is that I can not generate a placement program because it says that the ANC is not registered. I can look at it on the sy
Electronics Forum | Wed Aug 22 02:50:59 EDT 2012 | robertwillis
Are you having any process problems with Package On Package Assembly? If so why not spend a few hours with the POP Team at SMTA International? You have a great opportunity to see, hear and experience POP in October. However if you really can't join
Electronics Forum | Thu Aug 30 21:25:17 EDT 2012 | kahrpr
And that is where I see the problem. When companies have failures that are unexplained they blame ESD. It’s the scapegoat failure. And the industry through fear has us so paranoid We have companies worrying whether if your hair is 2 inches long or 3
Electronics Forum | Fri Aug 31 11:17:51 EDT 2012 | markhoch
My answer is f) ALL OF THE ABOVE. Depending on the type of equipment needed, I first research possible suppliers using the interwebs. I then request more information from any possible suppliers that I may find. Then I'll contact a local rep to see i
Electronics Forum | Mon Sep 17 03:59:52 EDT 2012 | stivais
Hi guys, We have an interesting case we haven't seen before (see the picture below) http://postimage.org/image/lu2f4ae55/ Solder balls form on unpopulated pads after reflow. 1. Reflow profile is fine. 2. Stencil thickness / paste volume is also f
Electronics Forum | Tue Sep 25 11:50:37 EDT 2012 | davef
Ken ... I resized your picture so that it fits on the page better. Continuing with your outgassing through the solder pads theory, how thick is the copper on the pads? I don't expect to see outgassing through pad that are a thou or more in thickness
Electronics Forum | Wed Oct 03 19:28:58 EDT 2012 | rgduval
Given that you're seeing it on nearly every part, we tend to lean towards Dave's explanation. We wouldn't expect outgassing from the pad to be an issue (at least, we've never heard of it before, which doesn't, necessarily, eliminate it as a potentia
Electronics Forum | Thu Oct 25 13:33:18 EDT 2012 | cyber_wolf
Ken, The photo looks like results I have seen because the gold flash was too thick on the board. This causes a condition known as gold imbrittlement. You may want to get an analysis of the plating thickness. I'm not real experienced with immersion si
