Electronics Forum: mani (Page 392 of 496)

Re: CCGA

Electronics Forum | Mon Jun 01 20:37:54 EDT 1998 | D.Lange

| | Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | | As everyone knows, IBM had problems with their ceramic

Re: Residue

Electronics Forum | Wed May 27 16:02:32 EDT 1998 | Chrys

| We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized to

Re: Residue

Electronics Forum | Wed May 27 14:20:43 EDT 1998 | Earl Moon

| We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized to

Re: Residue/Cure Testing Of Solder Mask

Electronics Forum | Fri May 29 17:07:00 EDT 1998 | Dave F

| | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized

Re: Residue

Electronics Forum | Tue May 26 15:53:39 EDT 1998 | Chrys

| We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized to

Re: Residue

Electronics Forum | Tue May 26 16:35:53 EDT 1998 | Ryan Jennens

| | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized

Re: Component Baking

Electronics Forum | Fri May 22 13:20:33 EDT 1998 | Earl Moon

| | | Does anyone know about low pressure/low temperature | | | ovens used for baking of moisture senstive | | | components? | | | Thanks | | I need to know from where your need came. I usually just bake in conventional ovens with specified times a

Re: Micro balls on gold fingers

Electronics Forum | Tue May 19 12:29:59 EDT 1998 | Richard Jackson

| Richard, | You may be encountering solder paste contamination | on the assembly during the printing process. Solder | will reflow on tin/lead plated lands therefore invisible. | If you are washing the assembly prior to inspection | then you are

Re: Ok Earl I give already! How about the "Library"

Electronics Forum | Tue May 19 18:56:29 EDT 1998 | Dave F

| | Earl, | | I admit that I missed your article since I seemed to have let my subscription to Circuit Fabrication Magazine expire. I am interested in your experience in this area. Is there a way to get a copy of your paper? Could you maybe post i

Earl, send it to me!send it to me!please!

Electronics Forum | Tue May 19 16:32:54 EDT 1998 | Chrys

| | Earl, | | I admit that I missed your article since I seemed to have let my subscription to Circuit Fabrication Magazine expire. I am interested in your experience in this area. Is there a way to get a copy of your paper? Could you maybe post i


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