Electronics Forum | Tue Feb 18 20:04:38 EST 2020 | SMTA-Alex
Sebas, some things in your profile don't make sense. 3 of your thermocouples, #1 # 4 and #6 are consistent. The others show completely different data. The consistent thermocouples, also, show peak temp at 241 - 243 degrees. That is extermely high for
Electronics Forum | Mon May 09 12:26:17 EDT 2005 | stepheniii
If followed, would the following strategy meet the requirements of IPC/JEDEC J-STD-033A; All MSD components are either exposed for less than 1/2 an hour or final reflowed within 12 hours of opening. What I mean by exposed is any time the parts are n
Electronics Forum | Mon Mar 30 11:39:46 EDT 2009 | rgduval
Is this a sample board that you ran without components? If so, I'd get it back to your board house, and ask them to explain to you what's happening. We never did get to a satisfactory root cause on our issue (at least, satisfactory to me). It seem
Electronics Forum | Tue Mar 28 15:01:57 EST 2006 | solderiron
Oh no you caught me. I'm a salesperson. "We" refers to the dozen or so customers I have sold this alloy to. We refers to all the data that can be found via the internet. The product is patented by Nihon superior and has proven reliability. Look if y
Electronics Forum | Wed Jul 16 18:21:20 EDT 2008 | emti
BGA Placement is not easy as we think, Mainly you have to make sure you don't have acceessive amount of paste, try to paste your board as it covers full ball, make sure it is not short before you place any part. If you placing the BGA by hand be car
Electronics Forum | Fri Aug 17 08:37:47 EDT 2001 | jbieber
Gregory, I think that the profile is too radical, i.e. zone 6 to zone 7 temperatures are too far apart. I would guess that the solderjoints have not all reached 183C in zone 6 which is why the uBGA's do not have a symmetrical ball collapse. You may
Electronics Forum | Sat Jan 06 22:09:53 EST 2001 | Greenman
Cory, I've got a lot of experience of testing of this type. The physical (not chemical) nature of the flux residues is the crucial issue in compatibility. If you have a softer residue (either caused by a thick initial solder paste deposit, or a low p
Electronics Forum | Thu Aug 17 09:38:28 EDT 2006 | pjc
Having the last two zones at the reflow temp (spike) is typically done on long ovens (10 zone) running at high conveyor speeds. This enables you to achieve peak temp and TAL as per the solderpaste specs at high production rates. Concerning reverse sp
Electronics Forum | Tue Jun 13 12:03:10 EDT 2000 | Chris May
Jason, If 225C is the topside temp of your board just prior to hitting the wave, I would say this is too high. Your flux suppliers data sheet should tell you an ideal topside temp for good flux activation, probably around 190C. According to the Bi
Electronics Forum | Mon Jun 12 10:57:51 EDT 2000 | Jason
I am new to wave soldering. Any information is greatly welcomed. Here is the problem. After soldering the boards they have a film on the bottom of them and sometimes a white powder looking substance. I have tried decreasing the amount of flux on
