Electronics Forum: tracking (Page 40 of 83)

BGA Voids

Electronics Forum | Tue Feb 12 18:48:48 EST 2008 | larryd

Thanks for the spare change. Questions are good and I did miss one item. Process has 100% solder paste inspection with a 3D inspection machine that has very few false calls or accepts. Ramp to peak is less than 1.5C/sec. Profile looks good, solder

surface mount connector, disturbed solder

Electronics Forum | Mon Apr 21 10:59:39 EDT 2008 | davef

That you have 'grainy' solder only at the ends of the connector and not at all solder connections indicates that your quality types are on track and are pointing you in a direction worthy of investigation and developing a better understanding of the

Solder Cracking

Electronics Forum | Mon Aug 11 09:59:40 EDT 2008 | John S.

Guys, We're seeing what looks like an issue where through hole solder joints from our ive solder process are cracking during the cooling phase of the soldering process. This was detected during thermal shock testing, and we have tracked it back to a

MSL/MSD Tracking

Electronics Forum | Wed Sep 03 12:44:34 EDT 2008 | Bob Douglas

When considering MSD issues two factors really need to be focused on; first, environmental control of the individual subject component/s during storage and second, monitoring of the packages out of the controlled environment. It's important that eac

PCB troubleshooting cause

Electronics Forum | Thu Aug 21 05:08:09 EDT 2008 | ihamon

Hi, We had a electric failure on a printed wired board after a few hours of functionning. We determined that the failure was caused by a open circuit in the PCB internal layer near to a via. We performed a microsection but unfortunately, it seemes t

PCB storage for lead Free

Electronics Forum | Tue Sep 16 09:35:12 EDT 2008 | babe7362000

Can anyone tell me if there is a procedure for storing raw PCB's? We currently are seeing an issue with lead free boards with dewetting. We tracked it down to one or two datecodes, but not all of the boards have dewetting. Is there a expiration da

wave pallets

Electronics Forum | Tue Feb 24 18:33:59 EST 2009 | gregoryyork

It is probably due to the solder mask being undercured and is porous alowing the flux to be absorbed which boils when it hits the solder wave that kills the adhesion. You should be seeing this only over copper traces/tracks. Reduce flux volume and in

Electrically-Conductive Tapes application advice?

Electronics Forum | Sun Aug 02 21:59:37 EDT 2009 | hohk

Wow! Thanks Jim!. When the ejector pin hits the piezo ceramic sensor, the sensor will produce a voltage difference between the top and bottom surface(that's why i need to connect the tracks on both sides) which i will measure. The sensor does not ne

Component price database - which or how?

Electronics Forum | Wed Sep 02 09:05:53 EDT 2009 | jamyboy

yes you can have Partminer only look to franchised distributors....but we have gotten our best deals from overseas OEMs that just have leftover parts. Also if there is ever a question about counterfeits etc. I believe that they have an independent te

SMT Taping Machine

Electronics Forum | Wed Sep 08 07:49:01 EDT 2010 | vleasher

We are a CM looking to do some low volume taping for the purpose of getting some undesirable parts out of track feeders. We don't always buy in the volume to get reel and it seems some components ie.Maxim only seem to come in tube. Is it typical for


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